MediaTek Dimensity 1000C vs Qualcomm Snapdragon 670. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Family
  Mediatek Dimensity Qualcomm Snapdragon
• Generation
  1 6
• CPU group
  MediaTek Dimensity 1000 Qualcomm Snapdragon 670

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequency
  2.00 GHz 1.70 GHz
• CPU Cores
  8 8
• Turbo (1 Core)
  2.00 GHz 2.00 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  2.00 GHz 1.70 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A77 2x Kryo 360 Gold
• B core
  4x Cortex-A55 6x Kryo 360 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  ARM Mali-G57 MP5 Qualcomm Adreno 615
• GPU frequency
  0.95 GHz 0.70 GHz
• GPU (Turbo)
  No turbo 0.70 GHz
• Execution units
  5 0
• Shader
  80 256
• Max. GPU Memory
  4 GB --
• Max. displays
  2 0
• Generation
  Vallhall 1 6
• DirectX Version
  12 12.1
• Technology
  7 nm 10 nm
• Release date
  Q2/2020 Q2/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• AV1
  Decode No
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 670 and MediaTek Dimensity 1000C. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR4X-1866 LPDDR4X-1866
• Max. Memory
  12 GB
• ECC
  No No
• Memory channels
  4 2

• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 1000C and Qualcomm Snapdragon 670 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 1000C and Qualcomm Snapdragon 670, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• Architecture
  Cortex-A77 / Cortex-A55 Kryo 360
• Technology
  7 nm 10 nm
• Socket
  N/A N/A
• Release date
  Q3/2020 Q3/2018
• Part Number
  MT6883Z/CZA SDM670