MediaTek Dimensity 8000 vs Qualcomm Snapdragon 7 Gen 1. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Family
  Mediatek Dimensity Qualcomm Snapdragon
• CPU group
  MediaTek Dimensity 8000 Qualcomm Snapdragon 7/8 Gen 1
• Segment
  Mobile Mobile
• Generation
  3 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 6 / 6
• Core architecture
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A-Core
  4x Cortex-A78 1x
• B-Core
  4x Cortex-A55 2x
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• A-Core Frequency
  2.00 GHz (2.75 GHz) 3.20 GHz
• B-Core Frequency
  -- 2.60 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  ARM Mali-G610 MP6 no iGPU
• GPU (Turbo)
  No turbo No turbo
• Execution units
  6
• Max. displays
  1
• Generation
  Vallhall 3
• Direct X
  12 --
• Technology
  4 nm
• Release date
  Q2/2021

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode No
• h265 / HEVC (10 bit)
  Decode / Encode No
• h264
  Decode / Encode No
• VP8
  Decode / Encode No
• VP9
  Decode / Encode No
• AV1
  Decode No
• AVC
  Decode / Encode No
• VC-1
  Decode / Encode No
• JPEG
  Decode / Encode No

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 7 Gen 1 and MediaTek Dimensity 8000. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR5-6400 LPDDR5-6400
• Max. Memory
  16 GB
• Memory channels
  4 4
• ECC
  No No
• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 8000 and Qualcomm Snapdragon 7 Gen 1 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 8000 and Qualcomm Snapdragon 7 Gen 1, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• L2-Cache
  -- 2.00 MB
• L3-Cache
  -- 4.00 MB
• Architecture
  Cortex-A78 / Cortex-A55 Cortex-X2 / -A710 / -A510
• Technology
  5 nm 4 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Release date
  Q1/2022 Q2/2022
• Part Number
  -- SM8475
• Operating systems
  Android Android, Windows 10 (ARM)