Samsung Exynos 1330 vs MediaTek Dimensity 900. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Family
  Samsung Exynos Mediatek Dimensity
• CPU group
  Samsung Exynos 13xx MediaTek Dimensity 900/920
• Segment
  Mobile Mobile
• Generation
  7 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Overclocking
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  ARM Mali-G68 MP2 ARM Mali-G68 MP4
• GPU frequency
  0.85 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  2 4
• Shader
  32 64
• Max. displays
  1 1
• Generation
  Vallhall 2 Vallhall 2
• Technology
  6 nm 6 nm
• Release date
  Q2/2020 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode Decode
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Dimensity 900 and Samsung Exynos 1330. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR4XLPDDR5 LPDDR4XLPDDR5
• Max. Memory
  16 GB
• Memory channels
  0 4
• ECC
  No No

Analyze the TDP (Thermal Design Power) requirements of Samsung Exynos 1330 and MediaTek Dimensity 900 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Samsung Exynos 1330 and MediaTek Dimensity 900, including virtual machine technologies and fabrication processes.

• Technology
  5 nm 6 nm
• Socket
  -- N/A
• L3-Cache
  -- 2.00 MB
• Architecture
  Cortex-A78/-A55 Cortex-A78 / Cortex-A55
• Virtualization
  None None
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Release date
  Q1/2023 Q2/2021
• Part Number
  S5E8535 MT6877