Processor HiSilicon Kirin 810, specifications and benchmarks

This section provides a comprehensive overview of the processors generation and family, explaining the specific market segment it is designed for. It covers key details such as the CPUs position within its product lineup, its intended use cases (e.g., consumer, server, or workstation), and how its generation compares to previous models.

• Segment
  Mobile
• Family
  HiSilicon Kirin
• Generation
  6
• CPU group
  HiSilicon Kirin 810/820
• Predecessor
  --
• Successor
  --

HiSilicon Kirin 810. This section highlights key performance parameters of the processor, including the number of cores, threads, and clock speeds (base and boost frequencies). These metrics directly impact multitasking capabilities and overall system performance in both single-threaded and multi-threaded applications.

• Frequency
  1.90 GHz
• CPU Cores
  8
• Turbo (1 Core)
  2.20 GHz
• CPU Threads
  8
• Turbo (8 Cores)
  2.20 GHz
• Hyperthreading
  No
• Overclocking
  No
• Core architecture
  hybrid (big.LITTLE)
• A core
  2x Cortex-A76
• B core
  6x Cortex-A55
• C core
  --

This section provides details on the integrated graphics capabilities of the processor. It covers the architecture, performance characteristics, and supported technologies (e.g., DirectX, OpenGL), which are essential for systems without dedicated GPUs or for mobile devices that require energy-efficient graphics processing.

• GPU name
  ARM Mali-G52 MP6
• GPU frequency
  0.85 GHz
• GPU (Turbo)
  No turbo
• Execution units
  16
• Shader
  288
• Max. GPU Memory
  4 GB
• Max. displays
  2
• Generation
  Bifrost 2
• DirectX Version
  12
• Technology
  12 nm
• Release date
  Q1/2018

This section covers the built-in hardware codec support for video and image processing. The processor’s ability to handle codecs like H.264, HEVC, and VP9 directly influences its performance in tasks such as video playback, editing, and streaming. This hardware acceleration ensures smoother media handling with lower CPU utilization.

• h265 / HEVC (8 bit)
  Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode
• h264
  Decode / Encode
• VP9
  Decode / Encode
• VP8
  Decode / Encode
• AV1
  No
• AVC
  Decode / Encode
• VC-1
  Decode / Encode
• JPEG
  Decode / Encode

This section breaks down the technical characteristics of the memory supported by the processor, including the types (e.g., DDR4, DDR5), number of memory channels, and maximum supported memory speed. It also covers PCI Express support, which determines the bandwidth available for GPUs, SSDs, and other peripherals, critical for high-performance systems.

• Memory type
  LPDDR4X-2133
• Max. Memory
  6 GB
• ECC
  No
• Memory channels
  4
• PCIe version
• PCIe lanes

This section focuses on the hardware-based security technologies integrated into the processor. These include encryption support features such as AES-NI, Intel SGX, and AMD Secure Memory Encryption, which provide robust protection for sensitive data and help mitigate cybersecurity risks.

• AES-NI
  No

• TDP (PL1)
  5 W
• TDP up
  --
• TDP (PL2)
  --
• TDP down
  --
• Tjunction max.
  --

This section explains the underlying technologies that enable the processor to deliver high performance. It includes details about the manufacturing process (e.g., 7nm, 10nm), supported instruction sets (e.g., AVX, SSE), and virtual machine extensions that enhance compatibility and efficiency across various workloads.

• Instruction set (ISA)
  ARMv8-A64 (64 bit)
• Virtualization
  None
• ISA extensions
• L2-Cache
  --
• L3-Cache
  1.00 MB
• Architecture
  Cortex-A76 / Cortex-A55
• Technology
  7 nm
• Socket
  N/A
• Release date
  Q2/2019
• Part Number
  --

Common positions HiSilicon Kirin 810 CPU in popular benchmarks, for comparison with other models.

• Geekbench 5, 64bit (Single-Core)
  1036 place
• Geekbench 5, 64bit (Multi-Core)
  970 place
• iGPU - FP32 Performance (Single-precision GFLOPS)
  1435 place