HiSilicon Kirin 910T vs Intel Atom E3805. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Family
  HiSilicon Kirin Intel Atom
• Generation
  1 4
• CPU group
  HiSilicon Kirin 910 Intel Atom E3800

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequency
  1.80 GHz 1.33 GHz
• CPU Cores
  4 2
• Turbo (1 Core)
  1.80 GHz No turbo
• CPU Threads
  4 2
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  ARM Mali-450 MP4 no iGPU
• GPU frequency
  0.70 GHz
• GPU (Turbo)
  0.70 GHz No turbo
• Execution units
  4
• Shader
  64
• Max. displays
  1
• Generation
  Utgard
• Technology
  28nm
• Release date
  2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No No
• h265 / HEVC (10 bit)
  No No
• h264
  No No
• VP9
  No No
• VP8
  No No
• AV1
  No No
• AVC
  No No
• VC-1
  No No
• JPEG
  No No

Overview of the types and quantities of RAM supported by Intel Atom E3805 and HiSilicon Kirin 910T. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR3 DDR3L-1066 SO-DIMM
• Max. Memory
  8 GB
• ECC
  No Yes
• Memory channels
  1 1
• PCIe version
  2.0
• PCIe lanes
  4

• AES-NI
  No Yes

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 910T and Intel Atom E3805 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  3 W
• Tjunction max.
  -- 110 °C

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 910T and Intel Atom E3805, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  ARMv7-A32 (32 bit) x86-64 (64 bit)
• Virtualization
  None VT-x, VT-x EPT
• ISA extensions
  SSE4.1, SSE4.2
• L3-Cache
  -- 1.00 MB
• Architecture
  Cortex-A9 Bay Trail
• Technology
  28 nm 22 nm
• Socket
  N/A BGA 1170
• Release date
  Q1/2014 Q4/2014