HiSilicon Kirin 910T contre Intel Atom E3805. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Série
  HiSilicon Kirin Intel Atom
• Génération
  1 4
• Groupe de CPU
  HiSilicon Kirin 910 Intel Atom E3800

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Fréquence
  1.80 GHz 1.33 GHz
• Cœurs de CPU
  4 2
• Turbo (1 cœur)
  1.80 GHz Pas de turbo
• Fils de processeur
  4 2
• Hyperthreading
  Non Non
• Overclocking
  Non Non
• Architecture de base
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  ARM Mali-450 MP4 pas d'iGPU
• GPU frequency
  0.70 GHz
• GPU (Turbo)
  0.70 GHz Pas de turbo
• Unités d'exécution
  4
• Shader
  64
• Max. displays
  1
• Génération
  Utgard
• Processus technologique
  28nm
• Date de sortie
  2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Non Non
• h265 / HEVC (10 bit)
  Non Non
• h264
  Non Non
• VP9
  Non Non
• VP8
  Non Non
• AV1
  Non Non
• AVC
  Non Non
• VC-1
  Non Non
• JPEG
  Non Non

Overview of the types and quantities of RAM supported by Intel Atom E3805 et HiSilicon Kirin 910T. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR3 DDR3L-1066 SO-DIMM
• Max. Mémoire
  8 GB
• ECC
  Non Oui
• Canaux de mémoire
  1 1
• Version PCIe
  2.0
• Couloirs PCIe
  4

• AES-NI
  Non Oui

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 910T et Intel Atom E3805 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  3 W
• Température maximale
  -- 110 °C

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 910T et Intel Atom E3805, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv7-A32 (32 bit) x86-64 (64 bit)
• Virtualization
  None VT-x, VT-x EPT
• Extensions ISA
  SSE4.1, SSE4.2
• L3-Cache
  -- 1.00 MB
• Architecture
  Cortex-A9 Bay Trail
• Processus technologique
  28 nm 22 nm
• Socket
  N/A BGA 1170
• Date de sortie
  Q1/2014 Q4/2014