MediaTek Helio P70 vs MediaTek Helio G70. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Family
  Mediatek Helio Mediatek Helio
• CPU group
  MediaTek Helio P60/P70 MediaTek Helio G70/G80
• Segment
  Mobile Mobile
• Generation
  3 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Overclocking
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  ARM Mali-G72 MP3 ARM Mali-G52 MP2
• GPU frequency
  0.90 GHz 0.82 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  3 2
• Shader
  48 32
• Max. GPU Memory
  2 GB --
• Max. displays
  1 2
• Generation
  Bifrost 2 Bifrost 2
• Technology
  16 nm 16 nm
• Release date
  Q3/2017 Q3/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  No No
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio G70 and MediaTek Helio P70. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR4X-1800 LPDDR4X-1800
• Max. Memory
  8 GB 8 GB
• Memory channels
  2 2
• ECC
  No No

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio P70 and MediaTek Helio G70 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio P70 and MediaTek Helio G70, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• ISA extensions
  --
• Architecture
  Cortex-A73 / Cortex-A53 Cortex-A75 / Cortex-A55
• Technology
  12 nm 12 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Release date
  Q2/2020 Q1/2020
• Part Number
  -- MT6769V/CB