MediaTek Helio P70 gegen MediaTek Helio G70. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Mediatek Helio Mediatek Helio
• CPU Gruppe
  MediaTek Helio P60/P70 MediaTek Helio G70/G80
• Segment
  Mobile Mobile
• Generation
  3 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  ARM Mali-G72 MP3 ARM Mali-G52 MP2
• GPU frequency
  0.90 GHz 0.82 GHz
• GPU (Turbo)
  kein Turbo kein Turbo
• Ausführungseinheiten
  3 2
• Shader
  48 32
• Max. GPU Memory
  2 GB --
• Max. displays
  1 2
• Generation
  Bifrost 2 Bifrost 2
• technisches verfahren
  16 nm 16 nm
• Datum der Veröffentlichung
  Q3/2017 Q3/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Nein Nein
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio G70 und MediaTek Helio P70. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4X-1800 LPDDR4X-1800
• Max. Speicher
  8 GB 8 GB
• Speicherkanäle
  2 2
• ECC
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio P70 und MediaTek Helio G70 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio P70 und MediaTek Helio G70, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• ISA-Erweiterungen
  --
• Architektur
  Cortex-A73 / Cortex-A53 Cortex-A75 / Cortex-A55
• technisches verfahren
  12 nm 12 nm
• Virtualisierung
  None None
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q2/2020 Q1/2020
• Part Number
  -- MT6769V/CB