MediaTek Kompanio 500 vs Qualcomm Snapdragon 870. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Family
  Mediatek Kompanio Qualcomm Snapdragon
• CPU group
  MediaTek Kompanio 500 Qualcomm Snapdragon 865/870
• Segment
  Mobile Mobile
• Generation
  1 7

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Core architecture
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• Overclocking
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  ARM Mali-G72 MP3 Qualcomm Adreno 650
• GPU frequency
  0.80 GHz 0.25 GHz
• GPU (Turbo)
  No turbo 0.67 GHz
• Execution units
  3 2
• Shader
  48 512
• Max. GPU Memory
  2 GB --
• Max. displays
  1 1
• Generation
  Bifrost 2 6
• Technology
  16 nm 7 nm
• Release date
  Q3/2017 Q4/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  No No
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 870 and MediaTek Kompanio 500. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR3LPDDR4X LPDDR4X-4266LPDDR5-5500
• Max. Memory
  16 GB
• Memory channels
  0 4
• ECC
  No No

Analyze the TDP (Thermal Design Power) requirements of MediaTek Kompanio 500 and Qualcomm Snapdragon 870 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  10 W

Information on architecture, interfaces, and additional instructions supported by MediaTek Kompanio 500 and Qualcomm Snapdragon 870, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  -- 2.00 MB
• L3-Cache
  -- 3.00 MB
• Architecture
  Cortex-A73 / Cortex-A53 Kryo 585
• Technology
  12 nm 7 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Release date
  Q4/2019 Q2/2021
• Part Number
  MT8183 SM8250-AC