MediaTek Kompanio 500 gegen Qualcomm Snapdragon 870. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Mediatek Kompanio Qualcomm Snapdragon
• CPU Gruppe
  MediaTek Kompanio 500 Qualcomm Snapdragon 865/870
• Segment
  Mobile Mobile
• Generation
  1 7

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  ARM Mali-G72 MP3 Qualcomm Adreno 650
• GPU frequency
  0.80 GHz 0.25 GHz
• GPU (Turbo)
  kein Turbo 0.67 GHz
• Ausführungseinheiten
  3 2
• Shader
  48 512
• Max. GPU Memory
  2 GB --
• Max. displays
  1 1
• Generation
  Bifrost 2 6
• technisches verfahren
  16 nm 7 nm
• Datum der Veröffentlichung
  Q3/2017 Q4/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Nein Nein
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 870 und MediaTek Kompanio 500. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR3LPDDR4X LPDDR4X-4266LPDDR5-5500
• Max. Speicher
  16 GB
• Speicherkanäle
  0 4
• ECC
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of MediaTek Kompanio 500 und Qualcomm Snapdragon 870 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  10 W

Information on architecture, interfaces, and additional instructions supported by MediaTek Kompanio 500 und Qualcomm Snapdragon 870, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  -- 2.00 MB
• L3-Cache
  -- 3.00 MB
• Architektur
  Cortex-A73 / Cortex-A53 Kryo 585
• technisches verfahren
  12 nm 7 nm
• Virtualisierung
  None None
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q4/2019 Q2/2021
• Part Number
  MT8183 SM8250-AC