Qualcomm Snapdragon 860 vs MediaTek Helio G96. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Family
  Qualcomm Snapdragon Mediatek Helio
• Generation
  6 1
• CPU group
  Qualcomm Snapdragon 855/860 MediaTek Helio G90
• Predecessor
  Qualcomm Snapdragon 855+ --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequency
  1.80 GHz 2.00 GHz
• CPU Cores
  8 8
• Turbo (1 Core)
  2.96 GHz 2.05 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  2.42 GHz 2.00 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• A core
  1x Kryo 485 Prime 2x Cortex-A76
• B core
  3x Kryo 485 Gold 6x Cortex-A55
• C core
  4x Kryo 485 Silver --

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  Qualcomm Adreno 640 ARM Mali-G57 MP2
• GPU frequency
  0.25 GHz 0.90 GHz
• GPU (Turbo)
  0.68 GHz No turbo
• Execution units
  4 2
• Shader
  384 32
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  1 2
• Generation
  5 Vallhall 1
• DirectX Version
  12.0 12
• Technology
  7 nm 7 nm
• Release date
  Q1/2019 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  No Decode
• AVC
  No Decode / Encode
• VC-1
  No Decode / Encode
• JPEG
  No Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio G96 and Qualcomm Snapdragon 860. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR4X-2133 LPDDR4X-2133
• Max. Memory
  16 GB 10 GB
• ECC
  No No
• Memory channels
  4 2
• PCIe version
  --
• PCIe lanes
  --

• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 860 and MediaTek Helio G96 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 860 and MediaTek Helio G96, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• ISA extensions
  --
• L2-Cache
  2.00 MB --
• L3-Cache
  3.00 MB --
• Architecture
  Kryo 485 Cortex-A76 / Cortex-A55
• Technology
  7 nm 12 nm
• Socket
  N/A N/A
• Release date
  Q1/2021 Q3/2021
• Part Number
  SM8150-AC --