Qualcomm Snapdragon 860 vs MediaTek Helio G96. 사양, 성능, 테스트

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 세그먼트
  Mobile Mobile
• 가족
  Qualcomm Snapdragon Mediatek Helio
• 세대
  6 1
• CPU 그룹
  Qualcomm Snapdragon 855/860 MediaTek Helio G90
• 이전 버전
  Qualcomm Snapdragon 855+ --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 빈도
  1.80 GHz 2.00 GHz
• CPU 코어
  8 8
• Turbo (1 Core)
  2.96 GHz 2.05 GHz
• CPU 스레드
  8 8
• Turbo (8 Cores)
  2.42 GHz 2.00 GHz
• Hyperthreading
  아니요 아니요
• 오버클러킹
  아니요 아니요
• 핵심 아키텍처
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• A core
  1x Kryo 485 Prime 2x Cortex-A76
• B core
  3x Kryo 485 Gold 6x Cortex-A55
• C core
  4x Kryo 485 Silver --

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU 이름
  Qualcomm Adreno 640 ARM Mali-G57 MP2
• GPU frequency
  0.25 GHz 0.90 GHz
• GPU (Turbo)
  0.68 GHz 터보 없음
• 실행 단위
  4 2
• Shader
  384 32
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  1 2
• 세대
  5 Vallhall 1
• DirectX Version
  12.0 12
• 기술
  7 nm 7 nm
• 릴리스 날짜
  Q1/2019 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  아니요 Decode
• AVC
  아니요 Decode / Encode
• VC-1
  아니요 Decode / Encode
• JPEG
  아니요 Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio G96 그리고 Qualcomm Snapdragon 860. The supported memory frequencies may vary depending on the motherboard configuration.

• 메모리 유형
  LPDDR4X-2133 LPDDR4X-2133
• 최대. Memory
  16 GB 10 GB
• ECC
  아니요 아니요
• 메모리 채널
  4 2
• PCIe 버전
  --
• PCIe 레인
  --

• AES-NI
  아니요 아니요

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 860 그리고 MediaTek Helio G96 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 860 그리고 MediaTek Helio G96, including virtual machine technologies and fabrication processes.

• 명령어 세트(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 가상화
  None None
• ISA 확장
  --
• L2-Cache
  2.00 MB --
• L3-Cache
  3.00 MB --
• 아키텍처
  Kryo 485 Cortex-A76 / Cortex-A55
• 기술
  7 nm 12 nm
• 소켓
  N/A N/A
• 릴리스 날짜
  Q1/2021 Q3/2021
• Part Number
  SM8150-AC --