UNISOC T310 vs Samsung Exynos 7884. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Family
  UNISOC 4G Samsung Exynos
• CPU group
  UNISOC 4G 12nm Samsung Exynos 7872/7884/7885/7904
• Segment
  Mobile Mobile
• Generation
  0 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  4 / 4 8 / 8
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A-Core
  1x Cortex-A75 2x Cortex-A73
• B-Core
  3x Cortex-A55 6x Cortex-A53
• Overclocking
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  PowerVR GE8300 ARM Mali-G71 MP2
• GPU frequency
  0.80 GHz 0.77 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  1 2
• Shader
  0 32
• Max. GPU Memory
  -- 2 GB
• Max. displays
  1 1
• Generation
  Bifrost 1
• Direct X
  10 11
• Technology
  20 nm 16 nm
• Release date
  Q1/2017 Q2/2016

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode
• h264
  No Decode / Encode
• VP8
  No Decode / Encode
• VP9
  No No
• AV1
  No No
• AVC
  No Decode / Encode
• VC-1
  No No
• JPEG
  No Decode / Encode

Overview of the types and quantities of RAM supported by Samsung Exynos 7884 and UNISOC T310. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR3-933LPDDR4-1333LPDDR4X-1333 LPDDR4-1866
• ECC
  No No
• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of UNISOC T310 and Samsung Exynos 7884 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by UNISOC T310 and Samsung Exynos 7884, including virtual machine technologies and fabrication processes.

• Technology
  12 nm 14 nm
• Socket
  -- N/A
• L2-Cache
  -- 2.00 MB
• Architecture
  Cortex-A73 / Cortex-A53
• Virtualization
  None None
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Release date
  Q2/2019 Q2/2018