AMD Ryzen Embedded V3C44 vs AMD Ryzen Embedded V3C18I. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Family
  AMD Ryzen Embedded V AMD Ryzen Embedded V
• CPU group
  AMD Ryzen Embedded V3000 AMD Ryzen Embedded V3000
• Segment
  Desktop / Server Desktop / Server
• Generation
  3 3
• Predecessor
  -- AMD Ryzen Embedded V2718

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  4 / 8 8 / 16
• Core architecture
  normal normal
• Cores
  4x Zen 3 8x Zen 3
• Hyperthreading / SMT
  Yes Yes
• Overclocking
  No No
• Frequency
  3.50 GHz 1.90 GHz
• Turbo Frequency (1 Core)
  3.80 GHz 3.80 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  no iGPU no iGPU
• GPU (Turbo)
  No turbo No turbo

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No No
• h265 / HEVC (10 bit)
  No No
• h264
  No No
• VP8
  No No
• VP9
  No No
• AV1
  No No
• AVC
  No No
• VC-1
  No No
• JPEG
  No No

Overview of the types and quantities of RAM supported by AMD Ryzen Embedded V3C18I and AMD Ryzen Embedded V3C44. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  DDR5-4800 DDR5-4800
• Max. Memory
  64 GB 64 GB
• Memory channels
  2 (Dual Channel) 2 (Dual Channel)
• Bandwidth
  76.8 GB/s 76.8 GB/s
• ECC
  Yes Yes
• PCIe
  4.0 x 20 4.0 x 20
• AES-NI
  Yes Yes

Analyze the TDP (Thermal Design Power) requirements of AMD Ryzen Embedded V3C44 and AMD Ryzen Embedded V3C18I to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  45 W 15 W
• TDP up
  54 W 25 W
• TDP down
  35 W 10 W
• Tjunction max.
  105 °C 105 °C

Information on architecture, interfaces, and additional instructions supported by AMD Ryzen Embedded V3C44 and AMD Ryzen Embedded V3C18I, including virtual machine technologies and fabrication processes.

• Technology
  6 nm 6 nm
• Chip design
  Chiplet Chiplet
• Socket
  FP7r2 FP7r2
• L2-Cache
  2.00 MB 4.00 MB
• L3-Cache
  8.00 MB 16.00 MB
• Architecture
  Rembrandt (Zen 3+) Rembrandt (Zen 3+)
• Operating systems
  Windows 10, Windows 11, Linux Windows 10, Windows 11, Linux
• Virtualization
  AMD-V, SVM AMD-V, SVM
• Instruction set (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• ISA extensions
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• Release date
  Q3/2022 Q3/2022
• Documents
  Technical data sheet Technical data sheet