Qualcomm Snapdragon 670 vs MediaTek Dimensity 1000L. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Family
  Qualcomm Snapdragon Mediatek Dimensity
• Generation
  6 1
• CPU group
  Qualcomm Snapdragon 670 MediaTek Dimensity 1000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequency
  1.70 GHz 2.00 GHz
• CPU Cores
  8 8
• Turbo (1 Core)
  2.00 GHz 2.20 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  1.70 GHz 2.00 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  2x Kryo 360 Gold 4x Cortex-A77
• B core
  6x Kryo 360 Silver 4x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  Qualcomm Adreno 615 ARM Mali-G77 MP7
• GPU frequency
  0.70 GHz 0.70 GHz
• GPU (Turbo)
  0.70 GHz No turbo
• Execution units
  0 7
• Shader
  256 112
• Max. GPU Memory
  -- 4 GB
• Max. displays
  0 1
• Generation
  6 Vallhall 1
• DirectX Version
  12.1 12
• Technology
  10 nm 7 nm
• Release date
  Q2/2018 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• h264
  Decode Decode / Encode
• VP9
  Decode Decode / Encode
• VP8
  Decode Decode / Encode
• AV1
  No Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Dimensity 1000L and Qualcomm Snapdragon 670. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR4X-1866 LPDDR4X-1866
• Max. Memory
  12 GB
• ECC
  No No
• Memory channels
  2 4

• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 670 and MediaTek Dimensity 1000L to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 670 and MediaTek Dimensity 1000L, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• Architecture
  Kryo 360 Cortex-A77 / Cortex-A55
• Technology
  10 nm 7 nm
• Socket
  N/A N/A
• Release date
  Q3/2018 Q1/2020
• Part Number
  SDM670 MT6885Z/CZA