Qualcomm Snapdragon 765G vs Qualcomm Snapdragon 765. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Family
  Qualcomm Snapdragon Qualcomm Snapdragon
• CPU group
  Qualcomm Snapdragon 760 Qualcomm Snapdragon 760
• Segment
  Mobile Mobile
• Generation
  3 3

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A-Core
  1x Kryo 475 Prime 1x Kryo 475 Prime
• B-Core
  1x Kryo 475 Gold 1x Kryo 475 Gold
• C-Core
  6x Kryo 475 Silver 6x Kryo 475 Silver
• Frequency
  1.80 GHz 1.80 GHz
• Turbo (1 Core)
  2.40 GHz 2.30 GHz
• Turbo (8 Cores)
  2.20 GHz 2.20 GHz
• Hyperthreading
  No No
• Overclocking
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  Qualcomm Adreno 620 Qualcomm Adreno 620
• GPU frequency
  0.75 GHz 0.63 GHz
• GPU (Turbo)
  No turbo No turbo
• Shader
  192 192
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• Generation
  6 6
• Direct X
  12.1 12.1
• Technology
  7 nm 7 nm
• Release date
  Q2/2019 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode Decode
• VP9
  Decode Decode
• AV1
  No No
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 765 and Qualcomm Snapdragon 765G. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR4-3733 LPDDR4-3733
• Max. Memory
  8 GB 8 GB
• Memory channels
  2 2
• ECC
  No No
• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 765G and Qualcomm Snapdragon 765 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W 5 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 765G and Qualcomm Snapdragon 765, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  2.00 MB 2.00 MB
• Architecture
  Kryo 475 Kryo 475
• Technology
  7 nm 7 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Release date
  Q3/2020 Q3/2020
• Part Number
  SM7250-AB SM7250-AA