Samsung Exynos 7420 vs HiSilicon Kirin 960. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Family
  Samsung Exynos HiSilicon Kirin
• CPU group
  Samsung Exynos 7420 HiSilicon Kirin 960
• Segment
  Mobile Mobile
• Generation
  1 5

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Frequency
  1.50 GHz 1.80 GHz
• Turbo (1 Core)
  2.10 GHz 2.40 GHz
• Turbo (8 Cores)
  2.10 GHz 2.40 GHz
• Hyperthreading
  No No
• Overclocking
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  ARM Mali-T760 MP8 ARM Mali-G71 MP8
• GPU frequency
  0.70 GHz 0.90 GHz
• GPU (Turbo)
  0.77 GHz No turbo
• Execution units
  8 8
• Shader
  128 256
• Max. GPU Memory
  -- 2 GB
• Max. displays
  2 2
• Generation
  Midgard 3 Bifrost 1
• Technology
  28nm 16 nm
• Release date
  Q4/2013 Q2/2016

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  No No
• AV1
  No No
• AVC
  No Decode / Encode
• VC-1
  No No
• JPEG
  No Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 960 and Samsung Exynos 7420. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR4-1600 LPDDR4-1600
• Max. Memory
  6 GB
• Memory channels
  0 2
• ECC
  No No

Analyze the TDP (Thermal Design Power) requirements of Samsung Exynos 7420 and HiSilicon Kirin 960 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by Samsung Exynos 7420 and HiSilicon Kirin 960, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  0.51 MB --
• L3-Cache
  -- 4.00 MB
• Architecture
  Cortex-A57 / Cortex-A53 Cortex-A73 / Cortex-A53
• Technology
  14 nm 16 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Release date
  Q2/2015 Q4/2016