AMD C-30 contra AMD C-50. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Serie
  AMD C AMD C
• Generación
  1 1
• Grupo CPU
  AMD C AMD C

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frecuencia
  1.20 GHz 1.00 GHz
• Núcleos de CPU
  1 2
• Turbo (1 núcleo)
  sin turbo sin turbo
• Hilos de la CPU
  1 2
• Hyperthreading
  No No
• Overclocking
  Sí Sí
• Arquitectura del núcleo
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  AMD Radeon HD 6250 AMD Radeon HD 6250
• GPU frequency
  0.28 GHz 0.28 GHz
• GPU (Turbo)
  sin turbo sin turbo
• Unidades de ejecución
  1 1
• Shader
  80 80
• Max. GPU Memory
  1 GB 1 GB
• Max. displays
  2 2
• Generación
  3 3
• DirectX Version
  11 11
• Proceso técnico
  40 nm 40 nm
• Fecha de publicación
  Q4/2010 Q4/2010

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No No
• h265 / HEVC (10 bit)
  No No
• h264
  Decode Decode
• VP9
  No No
• VP8
  No No
• AV1
  No No
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by AMD C-50 y AMD C-30. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  DDR3-1066 DDR3-1066
• ECC
  No No
• Canales de memoria
  1 1

• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of AMD C-30 y AMD C-50 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  9 W 9 W

Information on architecture, interfaces, and additional instructions supported by AMD C-30 y AMD C-50, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Virtualización
  AMD-V AMD-V
• Extensiones ISA
  SSE3, SSE4a SSE3, SSE4a
• L3-Cache
  1.00 MB 1.00 MB
• Arquitectura
  Ontario (Bobcat) Ontario (Bobcat)
• Proceso técnico
  40 nm 40 nm
• Enchufe
  BGA 413 BGA 413
• Fecha de publicación
  Q1/2011 Q1/2011