AMD Ryzen 7 3700C contra Intel Xeon Gold 5218B. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Desktop / Server Desktop / Server
• Serie
  AMD Ryzen Intel Xeon Gold
• Generación
  2 2
• Grupo CPU
  AMD Ryzen 3000C Intel Xeon Gold 5200/6200

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frecuencia
  2.30 GHz 2.30 GHz
• Núcleos de CPU
  4 16
• Turbo (1 núcleo)
  4.00 GHz 3.90 GHz
• Hilos de la CPU
  8 32
• Hyperthreading
  Sí Sí
• Overclocking
  No No
• Arquitectura del núcleo
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  AMD Radeon Vega 10 Graphics sin iGPU
• GPU frequency
  1.40 GHz
• GPU (Turbo)
  sin turbo sin turbo
• Unidades de ejecución
  10
• Shader
  640
• Max. GPU Memory
  2 GB --
• Max. displays
  3
• Generación
  8
• DirectX Version
  12
• Proceso técnico
  14 nm
• Fecha de publicación
  Q1/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode No
• h265 / HEVC (10 bit)
  Decode / Encode No
• h264
  Decode / Encode No
• VP9
  Decode / Encode No
• VP8
  Decode / Encode No
• AV1
  No No
• AVC
  Decode / Encode No
• VC-1
  Decode No
• JPEG
  Decode / Encode No

Overview of the types and quantities of RAM supported by Intel Xeon Gold 5218B y AMD Ryzen 7 3700C. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  DDR4-2666 DDR4-2666
• Max. Memoria
  64 GB
• ECC
  Sí Sí
• Canales de memoria
  2 6
• Versión PCIe
  3.0 3.0
• Carriles PCIe
  20 48

• AES-NI
  Sí Sí

Analyze the TDP (Thermal Design Power) requirements of AMD Ryzen 7 3700C y Intel Xeon Gold 5218B to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  15 W 125 W
• TDP up
  25 W --
• TDP down
  12 W --
• Temperatura máxima
  105 °C --

Information on architecture, interfaces, and additional instructions supported by AMD Ryzen 7 3700C y Intel Xeon Gold 5218B, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Virtualización
  AMD-V, SVM VT-x, VT-x EPT, VT-d
• Extensiones ISA
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4.1, SSE4.2, AVX2, AVX-512
• L2-Cache
  2.00 MB --
• L3-Cache
  4.00 MB 22.00 MB
• Arquitectura
  Picasso (Zen+) Cascade Lake
• Proceso técnico
  12 nm 14 nm
• Enchufe
  FP5 LGA 3647
• Fecha de publicación
  Q3/2020 Q2/2019