AMD Ryzen 9 5900 contra Intel Xeon E-2374G. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Desktop / Server Desktop / Server
• Serie
  AMD Ryzen Intel Xeon E
• Generación
  4 9
• Grupo CPU
  AMD Ryzen 5000 Intel Xeon E-2300
• Modelo anterior
  AMD Ryzen 9 3900 Intel Xeon E-2274G

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frecuencia
  3.50 GHz 3.70 GHz
• Núcleos de CPU
  12 4
• Turbo (1 núcleo)
  4.70 GHz 5.00 GHz
• Hilos de la CPU
  24 8
• Hyperthreading
  Sí Sí
• Overclocking
  Sí No
• Arquitectura del núcleo
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  sin iGPU Intel UHD Graphics P750
• GPU frequency
  0.35 GHz
• GPU (Turbo)
  sin turbo 1.30 GHz
• Unidades de ejecución
  32
• Shader
  256
• Max. displays
  3
• Generación
  12
• DirectX Version
  12
• Proceso técnico
  14 nm
• Fecha de publicación
  Q2/2021

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• h264
  No Decode / Encode
• VP9
  No Decode / Encode
• VP8
  No Decode
• AV1
  No Decode
• AVC
  No Decode / Encode
• VC-1
  No Decode
• JPEG
  No Decode / Encode

Overview of the types and quantities of RAM supported by Intel Xeon E-2374G y AMD Ryzen 9 5900. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  DDR4-3200 DDR4-3200
• Max. Memoria
  128 GB 128 GB
• ECC
  Sí No
• Canales de memoria
  2 2
• Versión PCIe
  4.0 4.0
• Carriles PCIe
  20 20

• AES-NI
  Sí Sí

Analyze the TDP (Thermal Design Power) requirements of AMD Ryzen 9 5900 y Intel Xeon E-2374G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  65 W 80 W
• Temperatura máxima
  95 °C 100 °C

Information on architecture, interfaces, and additional instructions supported by AMD Ryzen 9 5900 y Intel Xeon E-2374G, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Virtualización
  AMD-V, SVM VT-x, VT-x EPT, VT-d
• Extensiones ISA
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4.1, SSE4.2, AVX2, AVX-512
• L2-Cache
  6.00 MB 2.00 MB
• L3-Cache
  64.00 MB 8.00 MB
• Arquitectura
  Vermeer (Zen 3) Rocket Lake S
• Proceso técnico
  7 nm 14 nm
• Enchufe
  AM4 LGA 1200
• Fecha de publicación
  Q2/2021 Q3/2021