HiSilicon Kirin 925 contra Apple A8. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Serie
  HiSilicon Kirin Apple A series
• Generación
  2 8
• Grupo CPU
  HiSilicon Kirin 920 Apple A8/A8X
• Modelo anterior
  -- Apple A7
• Successor
  -- Apple A9

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frecuencia
  1.30 GHz 1.10 GHz
• Núcleos de CPU
  8 2
• Turbo (1 núcleo)
  1.80 GHz 1.50 GHz
• Hilos de la CPU
  8 2
• Hyperthreading
  No No
• Overclocking
  No No
• Arquitectura del núcleo
  hybrid (big.LITTLE) normal
• A core
  4x Cortex-A15 2x Typhoon
• B core
  4x Cortex-A7 --

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  ARM Mali-T628 MP4 Apple A8
• GPU frequency
  0.60 GHz 0.53 GHz
• GPU (Turbo)
  0.60 GHz sin turbo
• Unidades de ejecución
  4 4
• Shader
  64 128
• Max. GPU Memory
  -- 4 GB
• Max. displays
  1 1
• Generación
  Midgard 2 5
• DirectX Version
  11
• Proceso técnico
  32nm 20 nm
• Fecha de publicación
  Q4/2012 Q3/2014

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No No
• h265 / HEVC (10 bit)
  No No
• h264
  Decode / Encode Decode
• VP9
  No No
• VP8
  Decode / Encode No
• AV1
  No No
• AVC
  No Decode
• VC-1
  No Decode
• JPEG
  No Decode / Encode

Overview of the types and quantities of RAM supported by Apple A8 y HiSilicon Kirin 925. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR3-1600 LPDDR3-1600
• Max. Memoria
  2 GB
• ECC
  No No
• Canales de memoria
  2 1

• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 925 y Apple A8 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 925 y Apple A8, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  ARMv7-A32 (32 bit) x86-64 (64 bit)
• Virtualización
  None None
• L2-Cache
  -- 1.00 MB
• L3-Cache
  -- 4.00 MB
• Arquitectura
  Cortex-A15 / Cortex-A7 A8
• Proceso técnico
  28 nm 20 nm
• Enchufe
  N/A N/A
• Fecha de publicación
  Q3/2014 Q3/2014