Intel Xeon W-3175X contra MediaTek Dimensity 1100. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Desktop / Server Mobile
• Serie
  Intel Xeon W Mediatek Dimensity
• Generación
  6 2
• Grupo CPU
  Intel Xeon W-2100/3100 MediaTek Dimensity 1100/1200
• Successor
  Intel Xeon W-3275 --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frecuencia
  3.10 GHz 2.00 GHz
• Núcleos de CPU
  28 8
• Turbo (1 núcleo)
  3.80 GHz 2.60 GHz
• Hilos de la CPU
  56 8
• Hyperthreading
  Sí No
• Overclocking
  Sí No
• Arquitectura del núcleo
  normal hybrid (big.LITTLE)
• A core
  -- 4x Cortex-A78
• B core
  -- 4x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  sin iGPU ARM Mali-G77 MP9
• GPU frequency
  0.85 GHz
• GPU (Turbo)
  sin turbo sin turbo
• Unidades de ejecución
  9
• Shader
  144
• Max. GPU Memory
  -- 4 GB
• Max. displays
  1
• Generación
  Vallhall 1
• DirectX Version
  12
• Proceso técnico
  7 nm
• Fecha de publicación
  Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• h264
  No Decode / Encode
• VP9
  No Decode / Encode
• VP8
  No Decode / Encode
• AV1
  No Decode
• AVC
  No Decode / Encode
• VC-1
  No Decode / Encode
• JPEG
  No Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Dimensity 1100 y Intel Xeon W-3175X. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  DDR4-2666 LPDDR4X-2133
• Max. Memoria
  512 GB
• ECC
  Sí No
• Canales de memoria
  6 4
• Versión PCIe
  3.0
• Carriles PCIe
  48

• AES-NI
  Sí No

Analyze the TDP (Thermal Design Power) requirements of Intel Xeon W-3175X y MediaTek Dimensity 1100 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  255 W
• Temperatura máxima
  85 °C --

Information on architecture, interfaces, and additional instructions supported by Intel Xeon W-3175X y MediaTek Dimensity 1100, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  x86-64 (64 bit) ARMv8-A64 (64 bit)
• Virtualización
  VT-x, VT-x EPT, VT-d None
• Extensiones ISA
  SSE4.1, SSE4.2, AVX2, AVX-512
• L3-Cache
  38.50 MB --
• Arquitectura
  Skylake W Cortex-A78 / Cortex-A55
• Proceso técnico
  14 nm 6 nm
• Enchufe
  LGA 3647 N/A
• Fecha de publicación
  Q4/2018 Q1/2021
• Part Number
  -- MT6891Z/CZA