MediaTek Dimensity 9200 contra HiSilicon Kirin 990 5G. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Mediatek Dimensity HiSilicon Kirin
• Grupo CPU
  MediaTek Dimensity 9200 HiSilicon Kirin 990
• Segmento
  Mobile Mobile
• Generación
  4 8
• Modelo anterior
  MediaTek Dimensity 9000+ --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Arquitectura del núcleo
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)
• Overclocking
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  ARM Immortalis-G715 MP11 ARM Mali-G76 MP16
• GPU frequency
  0.90 GHz 0.60 GHz
• GPU (Turbo)
  sin turbo sin turbo
• Unidades de ejecución
  11 16
• Shader
  -- 256
• Max. GPU Memory
  -- 4 GB
• Max. displays
  -- 2
• Generación
  Vallhall Bifrost 3
• Proceso técnico
  4 nm 7 nm
• Fecha de publicación
  Q4/2022 Q3/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode No
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 990 5G y MediaTek Dimensity 9200. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR5X-8533 LPDDR4X-4266
• Max. Memoria
  -- 8 GB
• Canales de memoria
  4 (Quad Channel) 4
• ECC
  No No

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 9200 y HiSilicon Kirin 990 5G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  -- 6 W

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 9200 y HiSilicon Kirin 990 5G, including virtual machine technologies and fabrication processes.

• Proceso técnico
  4 nm 7 nm
• Enchufe
  N/A N/A
• L3-Cache
  -- 2.00 MB
• Arquitectura
  Cortex-X3 / -A715 / -A510 Cortex-A76 / Cortex-A55
• Virtualización
  None None
• Juego de instrucciones (ISA)
  ARMv9-A64 (64 bit) ARMv8-A64 (64 bit)
• Extensiones ISA
  --
• Fecha de publicación
  Q4/2022 Q3/2019