MediaTek Kompanio 1380 contra HiSilicon Kirin 985 5G. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Mediatek Kompanio HiSilicon Kirin
• Grupo CPU
  MediaTek Kompanio 900/1200/1300 HiSilicon Kirin 980
• Segmento
  Mobile Mobile
• Generación
  3 7

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Arquitectura del núcleo
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• Overclocking
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  ARM Mali-G57 MP5 ARM Mali-G77 MP8
• GPU frequency
  0.01 GHz 0.80 GHz
• GPU (Turbo)
  0.01 GHz sin turbo
• Unidades de ejecución
  5 8
• Shader
  80 128
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 1
• Generación
  Vallhall 1 Vallhall 1
• Proceso técnico
  7 nm 7 nm
• Fecha de publicación
  Q2/2020 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode Decode
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 985 5G y MediaTek Kompanio 1380. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR4X-2133 LPDDR4X-2133
• Canales de memoria
  4 4
• ECC
  No No

Analyze the TDP (Thermal Design Power) requirements of MediaTek Kompanio 1380 y HiSilicon Kirin 985 5G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Kompanio 1380 y HiSilicon Kirin 985 5G, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Arquitectura
  Cortex-A78 / Cortex-A55 Cortex-A76 / Cortex-A55
• Proceso técnico
  6 nm 7 nm
• Virtualización
  None None
• Enchufe
  N/A N/A
• Fecha de publicación
  Q1/2022 Q2/2020
• Part Number
  MT8195 Hi6290