Qualcomm Snapdragon 429 contra HiSilicon Kirin 910. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Serie
  Qualcomm Snapdragon HiSilicon Kirin
• Generación
  4 1
• Grupo CPU
  Qualcomm Snapdragon 429 HiSilicon Kirin 910

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frecuencia
  1.95 GHz 1.60 GHz
• Núcleos de CPU
  4 4
• Turbo (1 núcleo)
  1.95 GHz 1.60 GHz
• Hilos de la CPU
  4 4
• Turbo (4 Cores)
  1.95 GHz 1.60 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Arquitectura del núcleo
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  Qualcomm Adreno 504 ARM Mali-450 MP4
• GPU frequency
  0.50 GHz 0.53 GHz
• GPU (Turbo)
  0.50 GHz 0.53 GHz
• Unidades de ejecución
  0 4
• Shader
  0 64
• Max. displays
  0 1
• Generación
  5 Utgard
• DirectX Version
  11 0
• Proceso técnico
  12 nm 28nm
• Fecha de publicación
  Q2/2018 2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode No
• h265 / HEVC (10 bit)
  No No
• h264
  Decode / Encode No
• VP9
  No No
• VP8
  No No
• AV1
  No No
• AVC
  No No
• VC-1
  Decode No
• JPEG
  Decode / Encode No

Overview of the types and quantities of RAM supported by HiSilicon Kirin 910 y Qualcomm Snapdragon 429. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR3 LPDDR3
• ECC
  No No
• Canales de memoria
  1 1

• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 429 y HiSilicon Kirin 910 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 429 y HiSilicon Kirin 910, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  ARMv8-A64 (64 bit) ARMv7-A32 (32 bit)
• Virtualización
  None None
• Arquitectura
  Cortex-A53 Cortex-A9
• Proceso técnico
  12 nm 28 nm
• Enchufe
  N/A N/A
• Fecha de publicación
  Q3/2018 Q1/2014
• Part Number
  SDM429 --