Qualcomm Snapdragon 860 contra Qualcomm Snapdragon 7c. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Serie
  Qualcomm Snapdragon Qualcomm Snapdragon
• Generación
  6 2
• Grupo CPU
  Qualcomm Snapdragon 855/860 Qualcomm Snapdragon 7c
• Modelo anterior
  Qualcomm Snapdragon 855+ --
• Successor
  -- Qualcomm Snapdragon 7c Gen 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frecuencia
  1.80 GHz 2.40 GHz
• Turbo (1 núcleo)
  2.96 GHz 2.40 GHz
• Turbo (8 Cores)
  2.42 GHz 2.40 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Arquitectura del núcleo
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  Qualcomm Adreno 640 Qualcomm Adreno 618
• GPU frequency
  0.25 GHz 0.70 GHz
• GPU (Turbo)
  0.68 GHz sin turbo
• Unidades de ejecución
  4 0
• Shader
  384 128
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  1 2
• Generación
  5 6
• Proceso técnico
  7 nm 14 nm
• Fecha de publicación
  Q1/2019 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• AV1
  No No
• AVC
  No Decode
• VC-1
  No Decode
• JPEG
  No Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 7c y Qualcomm Snapdragon 860. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR4X-2133 LPDDR4X-2133
• Max. Memoria
  16 GB
• ECC
  No No
• Canales de memoria
  4 2

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 860 y Qualcomm Snapdragon 7c to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 860 y Qualcomm Snapdragon 7c, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualización
  None None
• L2-Cache
  2.00 MB --
• L3-Cache
  3.00 MB --
• Arquitectura
  Kryo 485 Kryo 468
• Proceso técnico
  7 nm 8 nm
• Enchufe
  N/A N/A
• Fecha de publicación
  Q1/2021 2020
• Part Number
  SM8150-AC SC7180