UNISOC T760 contra UNISOC T770. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  UNISOC 5G UNISOC 5G
• Grupo CPU
  UNISOC 5G 6nm UNISOC 5G 6nm
• Segmento
  Mobile Mobile

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• Arquitectura del núcleo
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A-Core
  4x Cortex-A76 1x Cortex-A76
• B-Core
  4x Cortex-A55 3x Cortex-A76
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• A-Core Frequency
  2.20 GHz 2.50 GHz
• B-Core Frequency
  2.00 GHz 2.20 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  ARM Mali-G57 MP4 ARM Mali-G57 MP4
• GPU frequency
  0.65 GHz 0.78 GHz
• GPU (Turbo)
  sin turbo sin turbo
• Unidades de ejecución
  4 4
• Shader
  64 64
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• Generación
  Vallhall 1 Vallhall 1
• Direct X
  12 12
• Proceso técnico
  7 nm 7 nm
• Fecha de publicación
  Q2/2020 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode Decode
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by UNISOC T770 y UNISOC T760. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR4X-2133 LPDDR4-2133LPDDR4X-2133
• Canales de memoria
  2 (Dual Channel) 2 (Dual Channel)
• ECC
  No No
• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of UNISOC T760 y UNISOC T770 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by UNISOC T760 y UNISOC T770, including virtual machine technologies and fabrication processes.

• Proceso técnico
  6 nm 6 nm
• Operating systems
  Android Android
• Virtualización
  None None
• Juego de instrucciones (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Fecha de publicación
  Q2/2021 Q1/2020
• especificación
  Technical data sheet Technical data sheet