AMD Ryzen Embedded V3C48 contre AMD EPYC 9554P. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Série
  AMD Ryzen Embedded V AMD EPYC
• Groupe de CPU
  AMD Ryzen Embedded V3000 AMD EPYC 9004
• Segment
  Desktop / Server Desktop / Server
• Génération
  3 4
• Modèle précédent
  AMD Ryzen Embedded V2748 --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 16 64 / 128
• Architecture de base
  normal normal
• Cœurs
  8x Zen 3 64x Zen 4
• Hyperthreading / SMT
  Oui Oui
• Overclocking
  Non Non
• Fréquence
  3.30 GHz 3.10 GHz
• Turbo Frequency (1 Core)
  3.80 GHz 3.75 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  pas d'iGPU pas d'iGPU
• GPU (Turbo)
  Pas de turbo Pas de turbo

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Non Non
• h265 / HEVC (10 bit)
  Non Non
• h264
  Non Non
• VP8
  Non Non
• VP9
  Non Non
• AV1
  Non Non
• AVC
  Non Non
• VC-1
  Non Non
• JPEG
  Non Non

Overview of the types and quantities of RAM supported by AMD EPYC 9554P et AMD Ryzen Embedded V3C48. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  DDR5-4800 DDR5-4800
• Max. Mémoire
  64 GB 6144 GB
• Canaux de mémoire
  2 (Dual Channel) 12
• Bandwidth
  76.8 GB/s 461.0 GB/s
• ECC
  Oui Oui
• PCIe
  4.0 x 20 5.0 x 128
• AES-NI
  Oui Oui

Analyze the TDP (Thermal Design Power) requirements of AMD Ryzen Embedded V3C48 et AMD EPYC 9554P to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  45 W 360 W
• TDP up
  54 W 400 W
• TDP down
  35 W 320 W
• Température maximale
  105 °C 100 °C

Information on architecture, interfaces, and additional instructions supported by AMD Ryzen Embedded V3C48 et AMD EPYC 9554P, including virtual machine technologies and fabrication processes.

• Processus technologique
  6 nm 5 nm
• Chip design
  Chiplet Chiplet
• Socket
  FP7r2 SP5
• L2-Cache
  4.00 MB 64.00 MB
• L3-Cache
  16.00 MB 256.00 MB
• Architecture
  Rembrandt (Zen 3+) Genoa (Zen 4)
• Operating systems
  Windows 10, Windows 11, Linux Windows Server 2022, Linux, Windows 11
• Virtualization
  AMD-V, SVM AMD-V, SVM
• Jeu d'instructions (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Extensions ISA
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4.2, AVX2, AVX-512, BFLOAT16, VNNI
• Date de sortie
  Q3/2022 Q4/2022
• Release price
  -- 7104 $
• Part Number
  -- 100-000000804
• spécification
  Technical data sheet Technical data sheet