HiSilicon Kirin 910 contre Qualcomm Snapdragon 439. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Série
  HiSilicon Kirin Qualcomm Snapdragon
• Génération
  1 4
• Groupe de CPU
  HiSilicon Kirin 910 Qualcomm Snapdragon 439

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Fréquence
  1.60 GHz 1.45 GHz
• Cœurs de CPU
  4 8
• Turbo (1 cœur)
  1.60 GHz 1.95 GHz
• Fils de processeur
  4 8
• Hyperthreading
  Non Non
• Overclocking
  Non Non
• Architecture de base
  normal hybrid (big.LITTLE)
• A core
  -- 4x Cortex-A53
• B core
  -- 4x Cortex-A53

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  ARM Mali-450 MP4 Qualcomm Adreno 505
• GPU frequency
  0.53 GHz 0.45 GHz
• GPU (Turbo)
  0.53 GHz 0.45 GHz
• Unités d'exécution
  4 Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système.
• Shader
  64 48
• Max. displays
  1 Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système.
• Génération
  Utgard 5
• DirectX Version
  Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système. 11
• Processus technologique
  28nm 28 nm
• Date de sortie
  2012 Q4/2015

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Non Decode
• h265 / HEVC (10 bit)
  Non Non
• h264
  Non Decode / Encode
• VP9
  Non Non
• VP8
  Non Non
• AV1
  Non Non
• AVC
  Non Non
• VC-1
  Non Decode
• JPEG
  Non Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 439 et HiSilicon Kirin 910. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR3 LPDDR3
• ECC
  Non Non
• Canaux de mémoire
  1 1

• AES-NI
  Non Non

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 910 et Qualcomm Snapdragon 439 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 910 et Qualcomm Snapdragon 439, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv7-A32 (32 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• Architecture
  Cortex-A9 Cortex-A53
• Processus technologique
  28 nm 12 nm
• Socket
  N/A N/A
• Date de sortie
  Q1/2014 Q3/2018
• Part Number
  -- SDM439