HiSilicon Kirin 970 contre Qualcomm Snapdragon 8cx Gen. 2. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Série
  HiSilicon Kirin Qualcomm Snapdragon
• Génération
  6 3
• Groupe de CPU
  HiSilicon Kirin 970 Qualcomm Snapdragon 8cx

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Fréquence
  1.84 GHz 1.80 GHz
• Turbo (1 cœur)
  2.40 GHz 2.84 GHz
• Turbo (8 Cores)
  2.40 GHz 2.84 GHz
• Hyperthreading
  Non Non
• Overclocking
  Non Non
• Architecture de base
  hybrid (big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  ARM Mali-G72 MP12 Qualcomm Adreno 690
• GPU frequency
  0.75 GHz 0.25 GHz
• GPU (Turbo)
  Pas de turbo 0.59 GHz
• Unités d'exécution
  12 Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système.
• Shader
  192 Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système.
• Max. GPU Memory
  2 GB --
• Max. displays
  1 Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système.
• Génération
  Bifrost 2 6
• Processus technologique
  16 nm 7 nm
• Date de sortie
  Q3/2017 Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode / Encode
• AV1
  Non Non
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 8cx Gen. 2 et HiSilicon Kirin 970. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR4X-2133 LPDDR4X-2133
• Max. Mémoire
  8 GB
• ECC
  Non Non
• Canaux de mémoire
  4 8

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 970 et Qualcomm Snapdragon 8cx Gen. 2 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  9 W 7 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 970 et Qualcomm Snapdragon 8cx Gen. 2, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• L3-Cache
  2.00 MB 2.00 MB
• Architecture
  Cortex-A73 / Cortex-A53 Kryo 495
• Processus technologique
  10 nm 7 nm
• Socket
  N/A N/A
• Date de sortie
  Q3/2017 Q4/2018