HiSilicon Kirin 985 5G contre HiSilicon Kirin 810. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Série
  HiSilicon Kirin HiSilicon Kirin
• Génération
  7 6
• Groupe de CPU
  HiSilicon Kirin 980 HiSilicon Kirin 810/820

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Fréquence
  1.84 GHz 1.90 GHz
• Cœurs de CPU
  8 8
• Turbo (1 cœur)
  2.40 GHz 2.20 GHz
• Fils de processeur
  8 8
• Turbo (8 Cores)
  2.58 GHz 2.20 GHz
• Hyperthreading
  Non Non
• Overclocking
  Non Non
• Architecture de base
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• A core
  1x Cortex-A76 2x Cortex-A76
• B core
  3x Cortex-A76 6x Cortex-A55
• C core
  4x Cortex-A55 --

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  ARM Mali-G77 MP8 ARM Mali-G52 MP6
• GPU frequency
  0.80 GHz 0.85 GHz
• GPU (Turbo)
  Pas de turbo Pas de turbo
• Unités d'exécution
  8 16
• Shader
  128 288
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  1 2
• Génération
  Vallhall 1 Bifrost 2
• DirectX Version
  12 12
• Processus technologique
  7 nm 12 nm
• Date de sortie
  Q2/2019 Q1/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  Decode Non
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 810 et HiSilicon Kirin 985 5G. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR4X-2133 LPDDR4X-2133
• Max. Mémoire
  6 GB
• ECC
  Non Non
• Canaux de mémoire
  4 4

• AES-NI
  Non Non

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 985 5G et HiSilicon Kirin 810 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 985 5G et HiSilicon Kirin 810, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• L3-Cache
  -- 1.00 MB
• Architecture
  Cortex-A76 / Cortex-A55 Cortex-A76 / Cortex-A55
• Processus technologique
  7 nm 7 nm
• Socket
  N/A N/A
• Date de sortie
  Q2/2020 Q2/2019
• Part Number
  Hi6290 --