Intel Core i3-2310M contre AMD Ryzen 7 2700. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Desktop / Server
• Série
  Intel Core i3 AMD Ryzen
• Génération
  2 2
• Groupe de CPU
  Intel Core i 2000M AMD Ryzen 2000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Fréquence
  2.10 GHz 3.20 GHz
• Cœurs de CPU
  2 8
• Turbo (1 cœur)
  Pas de turbo 4.10 GHz
• Fils de processeur
  4 16
• Hyperthreading
  Oui Oui
• Overclocking
  Non Oui
• Architecture de base
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  Intel HD Graphics 3000 pas d'iGPU
• GPU frequency
  0.65 GHz
• GPU (Turbo)
  1.10 GHz Pas de turbo
• Unités d'exécution
  12
• Shader
  96
• Max. displays
  2
• Génération
  6
• DirectX Version
  10.1
• Processus technologique
  32 nm
• Date de sortie
  Q1/2011

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Non Non
• h265 / HEVC (10 bit)
  Non Non
• h264
  Decode / Encode Non
• VP9
  Non Non
• VP8
  Non Non
• AV1
  Non Non
• AVC
  Decode / Encode Non
• VC-1
  Decode Non
• JPEG
  Non Non

Overview of the types and quantities of RAM supported by AMD Ryzen 7 2700 et Intel Core i3-2310M. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  DDR3-1066DDR3-1333 DDR4-2933
• Max. Mémoire
  16 GB 64 GB
• ECC
  Non Oui
• Canaux de mémoire
  2 2
• Version PCIe
  2.0 3.0
• Couloirs PCIe
  16 20

• AES-NI
  Oui Oui

Analyze the TDP (Thermal Design Power) requirements of Intel Core i3-2310M et AMD Ryzen 7 2700 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  35 W 65 W
• Température maximale
  100 °C 95 °C

Information on architecture, interfaces, and additional instructions supported by Intel Core i3-2310M et AMD Ryzen 7 2700, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Virtualization
  VT-x, VT-x EPT AMD-V, SVM
• Extensions ISA
  SSE4.1, SSE4.2, AVX SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• L3-Cache
  3.00 MB 16.00 MB
• Architecture
  Sandy Bridge H Pinnacle Ridge (Zen+)
• Processus technologique
  32 nm 12 nm
• Socket
  BGA 1023 AM4
• Date de sortie
  Q1/2011 Q2/2018