Intel Xeon w9-3475X contre AMD Ryzen Embedded V3C16. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Série
  Intel Xeon W AMD Ryzen Embedded V
• Groupe de CPU
  Intel Xeon W-3400 AMD Ryzen Embedded V3000
• Segment
  Desktop / Server Desktop / Server
• Génération
  12 3
• Modèle précédent
  Intel Xeon W-3375 AMD Ryzen Embedded V2516

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  36 / 72 6 / 12
• Architecture de base
  normal normal
• Cœurs
  36x 6x Zen 3
• Hyperthreading / SMT
  Oui Oui
• Overclocking
  Oui Non
• Fréquence
  2.20 GHz 2.00 GHz
• Turbo Frequency (1 Core)
  4.80 GHz 3.80 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  pas d'iGPU pas d'iGPU
• GPU (Turbo)
  Pas de turbo Pas de turbo

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Non Non
• h265 / HEVC (10 bit)
  Non Non
• h264
  Non Non
• VP8
  Non Non
• VP9
  Non Non
• AV1
  Non Non
• AVC
  Non Non
• VC-1
  Non Non
• JPEG
  Non Non

Overview of the types and quantities of RAM supported by AMD Ryzen Embedded V3C16 et Intel Xeon w9-3475X. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  DDR5-4800 DDR5-4800
• Max. Mémoire
  4096 GB 64 GB
• Canaux de mémoire
  8 (Octa Channel) 2 (Dual Channel)
• Bandwidth
  307.2 GB/s 76.8 GB/s
• ECC
  Oui Oui
• PCIe
  5.0 x 112 4.0 x 20
• AES-NI
  Oui Oui

Analyze the TDP (Thermal Design Power) requirements of Intel Xeon w9-3475X et AMD Ryzen Embedded V3C16 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP up
  360 W 25 W
• TDP down
  -- 10 W
• Température maximale
  95 °C 105 °C

Information on architecture, interfaces, and additional instructions supported by Intel Xeon w9-3475X et AMD Ryzen Embedded V3C16, including virtual machine technologies and fabrication processes.

• Processus technologique
  10 nm 6 nm
• Chip design
  Monolithic Chiplet
• Socket
  LGA 4677 FP7r2
• L2-Cache
  -- 3.00 MB
• L3-Cache
  82.50 MB 16.00 MB
• Architecture
  Sapphire Rapids-WS Rembrandt (Zen 3+)
• Operating systems
  Windows 11, Windows Server, Linux Windows 10, Windows 11, Linux
• Virtualization
  VT-x, VT-x EPT, VT-d, VT-rp, vPro Enterprise AMD-V, SVM
• Jeu d'instructions (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Extensions ISA
  SSE4.1, SSE4.2, AVX2, AVX-512, AMX SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• Date de sortie
  Q1/2023 Q3/2022
• Release price
  3739 $ --
• spécification
  Technical data sheet Technical data sheet