Qualcomm Snapdragon 410 contre Qualcomm Snapdragon 425. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Série
  Qualcomm Snapdragon Qualcomm Snapdragon
• Groupe de CPU
  Qualcomm Snapdragon 410 Qualcomm Snapdragon 425/427
• Segment
  Mobile Mobile
• Génération
  2 3

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architecture de base
  normal normal
• Fréquence
  1.20 GHz 1.40 GHz
• Turbo (1 cœur)
  1.20 GHz 1.40 GHz
• Turbo (4 Cores)
  1.20 GHz 1.40 GHz
• Hyperthreading
  Non Non
• Overclocking
  Non Non

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  Qualcomm Adreno 306 Qualcomm Adreno 308
• GPU frequency
  0.40 GHz 0.50 GHz
• GPU (Turbo)
  0.40 GHz 0.50 GHz
• Shader
  24 24
• Génération
  3 3
• Processus technologique
  28 nm 28 nm
• Date de sortie
  Q3/2012 Q1/2016

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  Non Non
• h264
  Decode / Encode Decode / Encode
• VP8
  Non Non
• VP9
  Non Non
• AV1
  Non Non
• AVC
  Non Non
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 425 et Qualcomm Snapdragon 410. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR2-533LPDDR3-533 LPDDR3-667
• Canaux de mémoire
  1 1
• ECC
  Non Non

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 410 et Qualcomm Snapdragon 425 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 410 et Qualcomm Snapdragon 425, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Architecture
  Cortex-A53 Cortex-A53
• Processus technologique
  28 nm 28 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Date de sortie
  2014 Q3/2016
• Part Number
  APQ8016 MSM8917