Qualcomm Snapdragon 7c Plus Gen 3 contre Apple M1. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Série
  Qualcomm Snapdragon Apple M series
• Groupe de CPU
  Qualcomm Snapdragon 7c Plus Apple M1
• Segment
  Mobile Mobile
• Génération
  3 1
• Modèle précédent
  Qualcomm Snapdragon 7c Gen 2 --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architecture de base
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Overclocking
  Non Non

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  Inconnu Apple M1 (8 Core)
• GPU frequency
  0.70 GHz 3.20 GHz
• GPU (Turbo)
  Pas de turbo Pas de turbo
• Unités d'exécution
  Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système. 128
• Max. GPU Memory
  -- 8 GB
• Max. displays
  Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système. 2
• Génération
  1
• Processus technologique
  5 nm
• Date de sortie
  Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Non Decode / Encode
• h265 / HEVC (10 bit)
  Non Decode / Encode
• h264
  Non Decode / Encode
• VP8
  Non Decode
• VP9
  Non Decode / Encode
• AV1
  Non Decode
• AVC
  Non Decode
• VC-1
  Non Decode
• JPEG
  Non Decode / Encode

Overview of the types and quantities of RAM supported by Apple M1 et Qualcomm Snapdragon 7c Plus Gen 3. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR4X-4266LPDDR5-6400 LPDDR4X-4266
• Max. Mémoire
  16 GB
• Canaux de mémoire
  2 2
• ECC
  Non Non

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 7c Plus Gen 3 et Apple M1 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  15 W
• TDP up
  -- 20 W
• TDP down
  -- 10 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 7c Plus Gen 3 et Apple M1, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Extensions ISA
  Rosetta 2 x86-Emulation
• L2-Cache
  -- 16.00 MB
• Architecture
  Cortex-A78 / Cortex-A55 M1
• Processus technologique
  6 nm 5 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Date de sortie
  Q1/2022 Q4/2020