Qualcomm Snapdragon 888 Plus contre Qualcomm Snapdragon 8 Gen 1. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Série
  Qualcomm Snapdragon Qualcomm Snapdragon
• Génération
  8 1
• Groupe de CPU
  Qualcomm Snapdragon 888 Qualcomm Snapdragon 8 Gen 1
• Modèle précédent
  -- Qualcomm Snapdragon 888

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Fréquence
  1.80 GHz 1.80 GHz
• Turbo (1 cœur)
  3.00 GHz 3.00 GHz
• Turbo (8 Cores)
  2.42 GHz 2.50 GHz
• Hyperthreading
  Non Non
• Overclocking
  Non Non
• Architecture de base
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  Qualcomm Adreno 660 Qualcomm Adreno 730
• GPU frequency
  0.84 GHz 0.84 GHz
• GPU (Turbo)
  Pas de turbo Pas de turbo
• Génération
  6 7
• Processus technologique
  5 nm 4 nm
• Date de sortie
  Q1/2021 Q1/2022

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  Non Non
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 8 Gen 1 et Qualcomm Snapdragon 888 Plus. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR5-3200 LPDDR5-3200
• Max. Mémoire
  16 GB
• ECC
  Non Non
• Canaux de mémoire
  4 4

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 888 Plus et Qualcomm Snapdragon 8 Gen 1 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 888 Plus et Qualcomm Snapdragon 8 Gen 1, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• Virtualization
  None None
• L2-Cache
  4.00 MB 2.00 MB
• L3-Cache
  4.00 MB 4.00 MB
• Architecture
  Kryo 680 Kryo
• Processus technologique
  5 nm 4 nm
• Socket
  N/A N/A
• Date de sortie
  Q3/2021 Q1/2022
• Part Number
  SM8350-AC SM8450