Intel Xeon Gold 5217
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Libéré
Q2/2019
Intel Xeon Gold 5217

Processeur Intel Xeon Gold 5217, spécifications et caractéristiques de référence

Le processeur Intel Xeon Gold 5217 est installé sur des cartes avec un socket LGA 3647 et fonctionne à une fréquence de 3.00 GHz. Le Intel Xeon Gold 5217 compte un total de 8 cœurs. Date de sortie : Q2/2019. Le TDP est de 115 W. Cet aperçu vous donnera toutes les spécifications techniques et des données détaillées sur le processeur Intel Xeon Gold 5217. Découvrez tout pour savoir si un jeu ou un logiciel fonctionnera sur le Intel Xeon Gold 5217.

Spécifications

Données techniques
CPU Family and Group

This section provides a comprehensive overview of the processors generation and family, explaining the specific market segment it is designed for. It covers key details such as the CPUs position within its product lineup, its intended use cases (e.g., consumer, server, or workstation), and how its generation compares to previous models.

  • Segment
    Desktop / Server
  • Série
  • Génération
    2
  • Groupe de CPU
    Intel Xeon Gold 5200/6200
  • Modèle précédent
    --
  • Successor
    --
CPU Technical Specs

Intel Xeon Gold 5217. This section highlights key performance parameters of the processor, including the number of cores, threads, and clock speeds (base and boost frequencies). These metrics directly impact multitasking capabilities and overall system performance in both single-threaded and multi-threaded applications.

  • Fréquence
    3.00 GHz
  • Cœurs de CPU
    8
  • Turbo (1 cœur)
    3.70 GHz
  • Fils de processeur
    16
  • Turbo (8 Cores)
    3.50 GHz
  • Hyperthreading
    Oui
  • Overclocking
    Non
  • Architecture de base
    normal
  • A core
    --
  • B core
    --
  • C core
    --
IGPU

This section provides details on the integrated graphics capabilities of the processor. It covers the architecture, performance characteristics, and supported technologies (e.g., DirectX, OpenGL), which are essential for systems without dedicated GPUs or for mobile devices that require energy-efficient graphics processing.

  • Nom du GPU
    pas d'iGPU
  • GPU frequency
  • GPU (Turbo)
    Pas de turbo
  • Unités d'exécution
  • Shader
  • Max. GPU Memory
    --
  • Max. displays
  • Génération
  • DirectX Version
  • Processus technologique
  • Date de sortie
Prise en charge des codecs matériels

This section covers the built-in hardware codec support for video and image processing. The processor’s ability to handle codecs like H.264, HEVC, and VP9 directly influences its performance in tasks such as video playback, editing, and streaming. This hardware acceleration ensures smoother media handling with lower CPU utilization.

  • h265 / HEVC (8 bit)
    Non
  • h265 / HEVC (10 bit)
    Non
  • h264
    Non
  • VP9
    Non
  • VP8
    Non
  • AV1
    Non
  • AVC
    Non
  • VC-1
    Non
  • JPEG
    Non
Memory Specs & PCI

This section breaks down the technical characteristics of the memory supported by the processor, including the types (e.g., DDR4, DDR5), number of memory channels, and maximum supported memory speed. It also covers PCI Express support, which determines the bandwidth available for GPUs, SSDs, and other peripherals, critical for high-performance systems.

  • Type de mémoire
    DDR4-2666
  • Max. Mémoire
  • ECC
    Oui
  • Canaux de mémoire
    6
  • Version PCIe
    3.0
  • Couloirs PCIe
    48
Cryptage

This section focuses on the hardware-based security technologies integrated into the processor. These include encryption support features such as AES-NI, Intel SGX, and AMD Secure Memory Encryption, which provide robust protection for sensitive data and help mitigate cybersecurity risks.

  • AES-NI
    Oui
Consommation d'énergie
  • TDP (PL1)
    115 W
  • TDP up
    --
  • TDP (PL2)
    --
  • TDP down
    --
  • Température maximale
    --
* voir ci-dessous
Technologies and Extensions

This section explains the underlying technologies that enable the processor to deliver high performance. It includes details about the manufacturing process (e.g., 7nm, 10nm), supported instruction sets (e.g., AVX, SSE), and virtual machine extensions that enhance compatibility and efficiency across various workloads.

  • Jeu d'instructions (ISA)
    x86-64 (64 bit)
  • Virtualization
    VT-x, VT-x EPT, VT-d
  • Extensions ISA
    SSE4.1, SSE4.2, AVX2, AVX-512
  • L2-Cache
    --
  • L3-Cache
    11.00 MB
  • Architecture
    Cascade Lake
  • Processus technologique
    14 nm
  • Socket
    LGA 3647
  • Date de sortie
    Q2/2019
  • Part Number
    --
Positions dans tous les classements

Positions communes Intel Xeon Gold 5217 CPU dans des benchmarks populaires, pour comparaison avec d'autres modèles.

No data

Benchmarks

Tests de performance CPU

Compare the benchmark scores of Intel Xeon Gold 5217 with other processors to gauge its real-world performance across various tasks..

These tests encompass tasks such as mathematical calculations, 3D rendering, cryptocurrency mining, and performance evaluations in both single-core and multi-core modes.

Synonymes

Processeurs similaires en termes de performances.

Similaire dans les processeurs de données techniques avec Intel Xeon Gold 5217.

AMD A4-4000 Voir
AMD Epyc 7313 Voir
AMD Epyc 7313P Voir
AMD Epyc 7302 Voir
AMD Epyc 7302P Voir
AMD Phenom II X6 1075T Voir
AMD Phenom II X4 940 Voir
AMD Phenom II X4 945 Voir

*

PL1 - The power limit (in watts) generated by the processor (or GPU) during sustained, standard operation. It represents the typical thermal output during normal workloads.

PL2 - Represents the maximum power limit under heavy load or overclocking conditions. It indicates the thermal output during peak performance.

These values are essential for determining the optimal cooling system and power supply required to maintain stable performance.

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Intel Xeon Gold 5217

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