Intel Xeon w9-3495X contro AMD Ryzen Embedded V3C16. Specifiche, prestazioni, test

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Intel Xeon W AMD Ryzen Embedded V
• Gruppo CPU
  Intel Xeon W-3400 AMD Ryzen Embedded V3000
• Segmento
  Desktop / Server Desktop / Server
• Generazione
  12 3
• Modello passato
  -- AMD Ryzen Embedded V2516

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  56 / 112 6 / 12
• Architettura di base
  normal normal
• Nuclei
  56x 6x Zen 3
• Hyperthreading / SMT
  Sì Sì
• Overclock
  Sì No
• Frequenza
  1.90 GHz 2.00 GHz
• Turbo Frequency (1 Core)
  4.80 GHz 3.80 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome della GPU
  no iGPU no iGPU
• GPU (Turbo)
  No turbo No turbo

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No No
• h265 / HEVC (10 bit)
  No No
• h264
  No No
• VP8
  No No
• VP9
  No No
• AV1
  No No
• AVC
  No No
• VC-1
  No No
• JPEG
  No No

Overview of the types and quantities of RAM supported by AMD Ryzen Embedded V3C16 e Intel Xeon w9-3495X. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo di memoria
  DDR5-4800 DDR5-4800
• Max. Memoria
  4096 GB 64 GB
• Canali di memoria
  8 (Octa Channel) 2 (Dual Channel)
• Bandwidth
  307.2 GB/s 76.8 GB/s
• ECC
  Sì Sì
• PCIe
  5.0 x 112 4.0 x 20
• AES-NI
  Sì Sì

Analyze the TDP (Thermal Design Power) requirements of Intel Xeon w9-3495X e AMD Ryzen Embedded V3C16 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP up
  420 W 25 W
• TDP down
  -- 10 W
• Temperatura massima
  99 °C 105 °C

Information on architecture, interfaces, and additional instructions supported by Intel Xeon w9-3495X e AMD Ryzen Embedded V3C16, including virtual machine technologies and fabrication processes.

• Processo tecnico
  10 nm 6 nm
• Chip design
  Monolithic Chiplet
• Presa
  LGA 4677 FP7r2
• L2-Cache
  -- 3.00 MB
• L3-Cache
  105.00 MB 16.00 MB
• Architettura
  Sapphire Rapids-WS Rembrandt (Zen 3+)
• Operating systems
  Windows 11, Windows Server, Linux Windows 10, Windows 11, Linux
• Virtualizzazione
  VT-x, VT-x EPT, VT-d, VT-rp, vPro Enterprise AMD-V, SVM
• Set di istruzioni (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Estensioni ISA
  SSE4.1, SSE4.2, AVX2, AVX-512, AMX SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• Data di rilascio
  Q1/2023 Q3/2022
• Release price
  5889 $ --
• Specifica
  Technical data sheet Technical data sheet