MediaTek Dimensity 1200 contro Qualcomm Snapdragon 765G. Specifiche, prestazioni, test

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Serie
  Mediatek Dimensity Qualcomm Snapdragon
• Generazione
  2 3
• Gruppo CPU
  MediaTek Dimensity 1100/1200 Qualcomm Snapdragon 760

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenza
  2.00 GHz 1.80 GHz
• Turbo (1 Core)
  3.00 GHz 2.40 GHz
• Turbo (8 Cores)
  2.60 GHz 2.20 GHz
• Hyperthreading
  No No
• Overclock
  No No
• Architettura di base
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome della GPU
  ARM Mali-G77 MP9 Qualcomm Adreno 620
• GPU frequency
  0.85 GHz 0.75 GHz
• GPU (Turbo)
  No turbo No turbo
• Unità di esecuzione
  9 0
• Shader
  144 192
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  1 2
• Generazione
  Vallhall 1 6
• Processo tecnico
  7 nm 7 nm
• Data di rilascio
  Q2/2019 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• AV1
  Decode No
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 765G e MediaTek Dimensity 1200. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo di memoria
  LPDDR4X-2133 LPDDR4-3733
• Max. Memoria
  8 GB
• ECC
  No No
• Canali di memoria
  4 2

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 1200 e Qualcomm Snapdragon 765G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 1200 e Qualcomm Snapdragon 765G, including virtual machine technologies and fabrication processes.

• Set di istruzioni (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualizzazione
  None None
• L3-Cache
  -- 2.00 MB
• Architettura
  Cortex-A78 / Cortex-A55 Kryo 475
• Processo tecnico
  6 nm 7 nm
• Presa
  N/A N/A
• Data di rilascio
  Q1/2021 Q3/2020
• Part Number
  MT6893 SM7250-AB