HiSilicon Kirin 9000 対 HiSilicon Kirin 990 4G. 仕様・性能・テスト

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• セグメント
  Mobile Mobile
• シリーズ
  HiSilicon Kirin HiSilicon Kirin
• 世代
  9 8
• CPUグループ
  HiSilicon Kirin 9000 HiSilicon Kirin 990

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 周波数
  2.05 GHz 1.86 GHz
• CPUコア
  8 8
• ターボ(1コア)
  3.13 GHz 2.09 GHz
• CPUスレッド
  8 8
• Turbo (8 Cores)
  2.54 GHz 2.86 GHz
• ハイパースレッディング
  いいえ いいえ
• オーバークロッキング
  いいえ いいえ
• コア・アーキテクチャ
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)
• A core
  1x Cortex-A77 2x Cortex-A76
• B core
  3x Cortex-A77 2x Cortex-A76
• C core
  4x Cortex-A55 4x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名
  ARM Mali-G78 MP24 ARM Mali-G76 MP16
• GPU frequency
  0.76 GHz 0.60 GHz
• GPU (Turbo)
  ターボなし ターボなし
• 実行部隊
  24 16
• シェーダー
  384 256
• Max. GPU Memory
  -- 4 GB
• Max. displays
  1 2
• 世代
  Vallhall 2 Bifrost 3
• DirectX Version
  12 12
• ぎじゅつてきなかだい
  5 nm 7 nm
• 発売日
  Q4/2020 Q3/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  Decode いいえ
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 990 4G と HiSilicon Kirin 9000. The supported memory frequencies may vary depending on the motherboard configuration.

• メモリータイプ
  LPDDR4X-2133LPDDR5-2750 LPDDR4X-2133
• マックス メモリ
  8 GB
• ECC
  いいえ いいえ
• メモリーチャンネル
  4 4

• AES-NI
  いいえ いいえ

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 9000 と HiSilicon Kirin 990 4G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  6 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 9000 と HiSilicon Kirin 990 4G, including virtual machine technologies and fabrication processes.

• 命令セット(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 仮想化
  None None
• L3-Cache
  -- 2.00 MB
• 建築
  Cortex-A77 / Cortex-A55 Cortex-A76 / Cortex-A55
• ぎじゅつてきなかだい
  5 nm 7 nm
• ソケット
  N/A N/A
• 発売日
  Q4/2020 Q3/2019