Intel Core i5-1140G7 対 Qualcomm Snapdragon 8c. 仕様・性能・テスト

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• セグメント
  Mobile Mobile
• シリーズ
  Intel Core i5 Qualcomm Snapdragon
• 世代
  11 3
• CPUグループ
  Intel Core i 1100G/11000U Qualcomm Snapdragon 8c

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 周波数
  1.80 GHz 1.80 GHz
• ターボ(1コア)
  4.20 GHz 2.45 GHz
• ハイパースレッディング
  はい いいえ
• オーバークロッキング
  いいえ いいえ
• コア・アーキテクチャ
  normal hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名
  Intel Iris Xe Graphics 80 (Tiger Lake G7) Qualcomm Adreno 675
• GPU frequency
  0.40 GHz 0.25 GHz
• GPU (Turbo)
  1.10 GHz 0.59 GHz
• 実行部隊
  80 7
• シェーダー
  640 672
• Max. GPU Memory
  16 GB 4 GB
• Max. displays
  4 1
• 世代
  12 5
• ぎじゅつてきなかだい
  10 nm 7 nm
• 発売日
  Q3/2020 Q4/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• VP8
  Decode Decode / Encode
• AV1
  Decode いいえ
• AVC
  Decode / Encode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 8c と Intel Core i5-1140G7. The supported memory frequencies may vary depending on the motherboard configuration.

• メモリータイプ
  LPDDR4X-4266 LPDDR4X-4266
• マックス メモリ
  32 GB 16 GB
• ECC
  いいえ いいえ
• メモリーチャンネル
  2 4

Analyze the TDP (Thermal Design Power) requirements of Intel Core i5-1140G7 と Qualcomm Snapdragon 8c to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  15 W 7 W
• TDP down
  7 W --
• 最高温度
  100 °C --

Information on architecture, interfaces, and additional instructions supported by Intel Core i5-1140G7 と Qualcomm Snapdragon 8c, including virtual machine technologies and fabrication processes.

• 命令セット(ISA)
  x86-64 (64 bit) ARMv8-A64 (64 bit)
• 仮想化
  VT-x, VT-x EPT, VT-d None
• ISAエクステンション
  SSE4.1, SSE4.2, AVX2, AVX-512
• L2-Cache
  -- 2.00 MB
• L3-Cache
  8.00 MB 3.00 MB
• 建築
  Tiger Lake U Kryo 490
• ぎじゅつてきなかだい
  10 nm 7 nm
• ソケット
  BGA 1526 N/A
• 発売日
  Q1/2021 Q4/2019