Qualcomm Snapdragon 435 対 MediaTek Helio P70. 仕様・性能・テスト

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• セグメント
  Mobile Mobile
• シリーズ
  Qualcomm Snapdragon Mediatek Helio
• 世代
  3 3
• CPUグループ
  Qualcomm Snapdragon 430 MediaTek Helio P60/P70

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• オーバークロッキング
  いいえ いいえ
• コア・アーキテクチャ
  normal hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名
  Qualcomm Adreno 505 ARM Mali-G72 MP3
• GPU frequency
  0.45 GHz 0.90 GHz
• GPU (Turbo)
  0.45 GHz ターボなし
• 実行部隊
  0 3
• シェーダー
  48 48
• Max. GPU Memory
  -- 2 GB
• Max. displays
  0 1
• 世代
  5 Bifrost 2
• ぎじゅつてきなかだい
  28 nm 16 nm
• 発売日
  Q4/2015 Q3/2017

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  いいえ Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  いいえ Decode / Encode
• VP8
  いいえ Decode / Encode
• AV1
  いいえ いいえ
• AVC
  いいえ Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio P70 と Qualcomm Snapdragon 435. The supported memory frequencies may vary depending on the motherboard configuration.

• メモリータイプ
  LPDDR3-800 LPDDR4X-1800
• マックス メモリ
  8 GB
• ECC
  いいえ いいえ
• メモリーチャンネル
  1 2

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 435 と MediaTek Helio P70 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 435 と MediaTek Helio P70, including virtual machine technologies and fabrication processes.

• 命令セット(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 仮想化
  None None
• 建築
  Cortex-A53 Cortex-A73 / Cortex-A53
• ぎじゅつてきなかだい
  28 nm 12 nm
• ソケット
  N/A N/A
• 発売日
  Q4/2016 Q2/2020
• Part Number
  MSM8940 --