Qualcomm Snapdragon 653 対 HiSilicon Kirin 650. 仕様・性能・テスト

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• セグメント
  Mobile Mobile
• シリーズ
  Qualcomm Snapdragon HiSilicon Kirin
• 世代
  4 4
• CPUグループ
  Qualcomm Snapdragon 650 HiSilicon Kirin 650

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 周波数
  1.44 GHz 1.70 GHz
• CPUコア
  8 8
• ターボ(1コア)
  1.95 GHz 2.00 GHz
• CPUスレッド
  8 8
• Turbo (8 Cores)
  1.44 GHz 2.00 GHz
• ハイパースレッディング
  いいえ いいえ
• オーバークロッキング
  いいえ いいえ
• コア・アーキテクチャ
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A72 4x Cortex-A53
• B core
  4x Cortex-A53 4x Cortex-A53

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名
  Qualcomm Adreno 510 ARM Mali-T830 MP2
• GPU frequency
  0.60 GHz 0.90 GHz
• GPU (Turbo)
  0.60 GHz 0.90 GHz
• 実行部隊
  0 2
• シェーダー
  128 32
• Max. displays
  0 2
• 世代
  5 Midgard 4
• DirectX Version
  11 11
• ぎじゅつてきなかだい
  14 nm 28nm
• 発売日
  Q4/2015 Q4/2015

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  いいえ Decode
• h264
  Decode Decode / Encode
• VP9
  Decode いいえ
• VP8
  Decode Decode / Encode
• AV1
  いいえ いいえ
• AVC
  いいえ いいえ
• VC-1
  Decode いいえ
• JPEG
  Decode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 650 と Qualcomm Snapdragon 653. The supported memory frequencies may vary depending on the motherboard configuration.

• メモリータイプ
  LPDDR3-933 LPDDR3-933
• ECC
  いいえ いいえ
• メモリーチャンネル
  2 2

• AES-NI
  いいえ いいえ

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 653 と HiSilicon Kirin 650 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 653 と HiSilicon Kirin 650, including virtual machine technologies and fabrication processes.

• 命令セット(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 仮想化
  None None
• 建築
  Cortex-A72 / Cortex-A53 Cortex-A53 / Cortex-A53
• ぎじゅつてきなかだい
  28 nm 16 nm
• ソケット
  N/A N/A
• 発売日
  Q4/2016 Q2/2016
• Part Number
  MSM8976 Pro --