Qualcomm Snapdragon 710 対 MediaTek Dimensity 1000C. 仕様・性能・テスト

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• シリーズ
  Qualcomm Snapdragon Mediatek Dimensity
• CPUグループ
  Qualcomm Snapdragon 710 MediaTek Dimensity 1000
• セグメント
  Mobile Mobile
• 世代
  1 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• コア・アーキテクチャ
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• 周波数
  1.70 GHz 2.00 GHz
• ターボ(1コア)
  2.20 GHz 2.00 GHz
• Turbo (8 Cores)
  2.20 GHz 2.00 GHz
• ハイパースレッディング
  いいえ いいえ
• オーバークロッキング
  いいえ いいえ

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名
  Qualcomm Adreno 616 ARM Mali-G57 MP5
• GPU frequency
  0.75 GHz 0.95 GHz
• GPU (Turbo)
  0.75 GHz ターボなし
• 実行部隊
  0 5
• シェーダー
  256 80
• Max. GPU Memory
  -- 4 GB
• Max. displays
  0 2
• 世代
  6 Vallhall 1
• ぎじゅつてきなかだい
  10 nm 7 nm
• 発売日
  Q2/2018 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• h264
  Decode Decode / Encode
• VP8
  Decode Decode / Encode
• VP9
  Decode Decode / Encode
• AV1
  いいえ Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Dimensity 1000C と Qualcomm Snapdragon 710. The supported memory frequencies may vary depending on the motherboard configuration.

• メモリータイプ
  LPDDR4X-1866 LPDDR4X-1866
• マックス メモリ
  8 GB 12 GB
• メモリーチャンネル
  2 4
• ECC
  いいえ いいえ

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 710 と MediaTek Dimensity 1000C to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 710 と MediaTek Dimensity 1000C, including virtual machine technologies and fabrication processes.

• 命令セット(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 建築
  Kryo 360 Cortex-A77 / Cortex-A55
• ぎじゅつてきなかだい
  10 nm 7 nm
• 仮想化
  None None
• ソケット
  N/A N/A
• 発売日
  Q2/2018 Q3/2020
• Part Number
  -- MT6883Z/CZA