Qualcomm Snapdragon 765G 対 Intel Core i5-1030NG7. 仕様・性能・テスト

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• シリーズ
  Qualcomm Snapdragon Intel Core i5
• CPUグループ
  Qualcomm Snapdragon 760 Intel Core i 1000G/10000U
• セグメント
  Mobile Mobile
• 世代
  3 10

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• コア・アーキテクチャ
  hybrid (big.LITTLE) normal
• 周波数
  1.80 GHz 1.10 GHz
• ターボ(1コア)
  2.40 GHz 3.50 GHz
• ハイパースレッディング
  いいえ はい
• オーバークロッキング
  いいえ いいえ

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名
  Qualcomm Adreno 620 Intel Iris Plus Graphics (Ice Lake G7)
• GPU frequency
  0.75 GHz 0.30 GHz
• GPU (Turbo)
  ターボなし 1.05 GHz
• 実行部隊
  0 64
• シェーダー
  192 512
• Max. GPU Memory
  4 GB --
• Max. displays
  2 3
• 世代
  6 11
• ぎじゅつてきなかだい
  7 nm 14 nm
• 発売日
  Q2/2019 Q3/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode Decode / Encode
• VP9
  Decode Decode / Encode
• AV1
  いいえ いいえ
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Intel Core i5-1030NG7 と Qualcomm Snapdragon 765G. The supported memory frequencies may vary depending on the motherboard configuration.

• メモリータイプ
  LPDDR4-3733 LPDDR4-3733
• マックス メモリ
  8 GB 32 GB
• メモリーチャンネル
  2 2
• ECC
  いいえ いいえ

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 765G と Intel Core i5-1030NG7 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W 10 W
• 最高温度
  -- 100 °C

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 765G と Intel Core i5-1030NG7, including virtual machine technologies and fabrication processes.

• 命令セット(ISA)
  ARMv8-A64 (64 bit) x86-64 (64 bit)
• ISAエクステンション
  SSE4.1, SSE4.2, AVX2
• L3-Cache
  2.00 MB 6.00 MB
• 建築
  Kryo 475 Ice Lake U
• ぎじゅつてきなかだい
  7 nm 10 nm
• 仮想化
  None VT-x, VT-x EPT, VT-d
• ソケット
  N/A BGA 1526
• 発売日
  Q3/2020 Q2/2020
• Part Number
  SM7250-AB --