AMD Ryzen Embedded R2312 vs AMD Ryzen Embedded R1600. 사양, 성능, 테스트

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 가족
  AMD Ryzen Embedded AMD Ryzen Embedded
• CPU 그룹
  AMD Ryzen Embedded R2000 AMD Ryzen Embedded R1000
• 세그먼트
  Desktop / Server Desktop / Server
• 세대
  2 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  2 / 4 2 / 4
• 핵심 아키텍처
  normal normal
• Cores
  4x 2x
• Hyperthreading / SMT
  예 예
• 오버클러킹
  아니요 아니요
• 빈도
  2.70 GHz 2.60 GHz
• Turbo Frequency (1 Core)
  3.50 GHz 3.10 GHz
• Turbo Frequency (2 Cores)
  3.10 GHz --

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU 이름
  AMD Radeon Vega 3 Graphics iGPU 없음
• GPU frequency
  1.20 GHz --
• GPU (Turbo)
  터보 없음 터보 없음
• 실행 단위
  3 --
• Shader
  192 --
• Max. GPU Memory
  2 GB --
• Max. displays
  3 --
• 세대
  8 --
• Direct X
  12 --
• 기술
  14 nm --
• 릴리스 날짜
  Q1/2018 --

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode 아니요
• h265 / HEVC (10 bit)
  Decode / Encode 아니요
• h264
  Decode / Encode 아니요
• VP8
  Decode / Encode 아니요
• VP9
  Decode / Encode 아니요
• AV1
  아니요 아니요
• AVC
  Decode / Encode 아니요
• VC-1
  Decode 아니요
• JPEG
  Decode / Encode 아니요

Overview of the types and quantities of RAM supported by AMD Ryzen Embedded R1600 그리고 AMD Ryzen Embedded R2312. The supported memory frequencies may vary depending on the motherboard configuration.

• 메모리 유형
  DDR4-2400 DDR4-2400
• 최대. Memory
  32 GB 32 GB
• 메모리 채널
  2 2
• Bandwidth
  38.4 GB/s 38.4 GB/s
• ECC
  예 예
• PCIe
  3.0 x 8 3.0 x 8
• AES-NI
  예 예

Analyze the TDP (Thermal Design Power) requirements of AMD Ryzen Embedded R2312 그리고 AMD Ryzen Embedded R1600 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  15 W 15 W
• TDP up
  25 W 25 W
• TDP down
  12 W 12 W
• 최대 접합.
  105 °C 105 °C

Information on architecture, interfaces, and additional instructions supported by AMD Ryzen Embedded R2312 그리고 AMD Ryzen Embedded R1600, including virtual machine technologies and fabrication processes.

• 명령어 세트(ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• ISA 확장
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• L2-Cache
  1.00 MB 1.00 MB
• L3-Cache
  2.00 MB 4.00 MB
• 아키텍처
  Zen+ Banded Kestrel (Zen)
• 문서
  -- Technical data sheet
• 기술
  12 nm 14 nm
• 가상화
  AMD-V, SVM AMD-V, SVM
• 소켓
  FP5 FP5
• 릴리스 날짜
  Q2/2022 Q2/2019