Qualcomm Snapdragon 680 4G vs HiSilicon Kirin 820 5G. 사양, 성능, 테스트

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 가족
  Qualcomm Snapdragon HiSilicon Kirin
• CPU 그룹
  Qualcomm Snapdragon 680 HiSilicon Kirin 810/820
• 세그먼트
  Mobile Mobile
• 세대
  6 6

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 핵심 아키텍처
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• 오버클러킹
  아니요 아니요

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU 이름
  Qualcomm Adreno 610 ARM Mali-G57 MP6
• GPU frequency
  0.85 GHz
• GPU (Turbo)
  터보 없음 터보 없음
• 실행 단위
  0 6
• Shader
  128 96
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  0 2
• 세대
  6 Vallhall 1
• 기술
  11 nm 7 nm
• 릴리스 날짜
  Q2/2019 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode Decode / Encode
• VP9
  Decode Decode / Encode
• AV1
  아니요 Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 820 5G 그리고 Qualcomm Snapdragon 680 4G. The supported memory frequencies may vary depending on the motherboard configuration.

• 메모리 유형
  LPDDR4X-2133 LPDDR4X-2133
• 최대. Memory
  4 GB
• 메모리 채널
  2 4
• ECC
  아니요 아니요

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 680 4G 그리고 HiSilicon Kirin 820 5G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  6 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 680 4G 그리고 HiSilicon Kirin 820 5G, including virtual machine technologies and fabrication processes.

• 명령어 세트(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  -- 2.00 MB
• 아키텍처
  Kryo 265 Cortex-A76 / Cortex-A55
• 기술
  6 nm 7 nm
• 가상화
  None None
• 소켓
  N/A N/A
• 릴리스 날짜
  Q1/2022 Q2/2019
• Part Number
  SM6225 --