Qualcomm Snapdragon 730 vs Qualcomm Snapdragon 675. 사양, 성능, 테스트

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 가족
  Qualcomm Snapdragon Qualcomm Snapdragon
• CPU 그룹
  Qualcomm Snapdragon 730 Qualcomm Snapdragon 675/678
• 세그먼트
  Mobile Mobile
• 세대
  2 7
• Successor
  -- Qualcomm Snapdragon 678

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 핵심 아키텍처
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• 빈도
  1.80 GHz 1.70 GHz
• Turbo (1 Core)
  2.20 GHz 2.00 GHz
• Turbo (8 Cores)
  2.20 GHz 1.70 GHz
• Hyperthreading
  아니요 아니요
• 오버클러킹
  아니요 아니요

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU 이름
  Qualcomm Adreno 618 Qualcomm Adreno 612
• GPU frequency
  0.70 GHz 0.85 GHz
• GPU (Turbo)
  터보 없음 0.85 GHz
• Shader
  128 0
• Max. GPU Memory
  4 GB --
• Max. displays
  2 0
• 세대
  6 6
• 기술
  14 nm 11 nm
• 릴리스 날짜
  Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode Decode
• VP9
  Decode Decode
• AV1
  아니요 아니요
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 675 그리고 Qualcomm Snapdragon 730. The supported memory frequencies may vary depending on the motherboard configuration.

• 메모리 유형
  LPDDR4X-1866 LPDDR4X-1866
• 최대. Memory
  8 GB
• 메모리 채널
  2 2
• ECC
  아니요 아니요

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 730 그리고 Qualcomm Snapdragon 675 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 730 그리고 Qualcomm Snapdragon 675, including virtual machine technologies and fabrication processes.

• 명령어 세트(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 아키텍처
  Kryo 470 Gold/475 Silver Kryo 460
• 기술
  8 nm 11 nm
• 가상화
  None None
• 소켓
  N/A N/A
• 릴리스 날짜
  Q2/2019 Q1/2019
• Part Number
  SM7150-AA SM6150