Qualcomm Snapdragon 855 Plus vs Qualcomm Snapdragon 8c. 사양, 성능, 테스트

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 가족
  Qualcomm Snapdragon Qualcomm Snapdragon
• CPU 그룹
  Qualcomm Snapdragon 855/860 Qualcomm Snapdragon 8c
• 세그먼트
  Mobile Mobile
• 세대
  6 3
• Successor
  Qualcomm Snapdragon 860 --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• 핵심 아키텍처
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• A-Core
  1x Kryo 485 Prime 4x Kryo 490 Gold
• B-Core
  3x Kryo 485 Gold 4x Kryo 490 Silver
• C-Core
  4x Kryo 485 Silver --
• 오버클러킹
  아니요 아니요

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU 이름
  Qualcomm Adreno 640 Qualcomm Adreno 675
• GPU frequency
  0.25 GHz 0.25 GHz
• GPU (Turbo)
  0.68 GHz 0.59 GHz
• 실행 단위
  4 7
• Shader
  384 672
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  1 1
• 세대
  5 5
• Direct X
  12.0 12.0
• 기술
  7 nm 7 nm
• 릴리스 날짜
  Q1/2019 Q4/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• AV1
  아니요 아니요
• AVC
  아니요 Decode
• VC-1
  아니요 Decode
• JPEG
  아니요 Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 8c 그리고 Qualcomm Snapdragon 855 Plus. The supported memory frequencies may vary depending on the motherboard configuration.

• 메모리 유형
  LPDDR4X-4266 LPDDR4X-4266
• 최대. Memory
  16 GB 16 GB
• 메모리 채널
  4 4
• ECC
  아니요 아니요
• AES-NI
  아니요 아니요

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 855 Plus 그리고 Qualcomm Snapdragon 8c to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  7 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 855 Plus 그리고 Qualcomm Snapdragon 8c, including virtual machine technologies and fabrication processes.

• 명령어 세트(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  2.00 MB 2.00 MB
• L3-Cache
  3.00 MB 3.00 MB
• 아키텍처
  Kryo 485 Kryo 490
• 기술
  7 nm 7 nm
• 가상화
  None None
• 소켓
  N/A N/A
• 릴리스 날짜
  Q4/2018 Q4/2019
• Part Number
  SM8150-AC --