AMD Epyc 7352
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Wynik ogólny
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Wydany
Q3/2019
AMD Epyc 7352

Procesor AMD Epyc 7352, specyfikacje i wzorce

Procesor AMD Epyc 7352 jest montowany w płytach z gniazdem SP3 i pracuje z częstotliwością 2.30 GHz. Procesor AMD Epyc 7352 ma 24 rdzeni. Data wydania: Q3/2019. TDP wynosi 155 W. Ta recenzja zawiera wszystkie dane techniczne i szczegółowe informacje o procesorze AMD Epyc 7352. Dowiedz się wszystkiego, aby ocenić, czy gra lub oprogramowanie będą działać na AMD Epyc 7352.

Specyfikacje

Dane techniczne
CPU Family and Group

This section provides a comprehensive overview of the processors generation and family, explaining the specific market segment it is designed for. It covers key details such as the CPUs position within its product lineup, its intended use cases (e.g., consumer, server, or workstation), and how its generation compares to previous models.

  • Segment
    Desktop / Server
  • Seria
  • Pokolenie
    2
  • Grupa CPU
    AMD Epyc 7002
  • Model z przeszłości
    --
  • Successor
    --
CPU Technical Specs

AMD Epyc 7352. This section highlights key performance parameters of the processor, including the number of cores, threads, and clock speeds (base and boost frequencies). These metrics directly impact multitasking capabilities and overall system performance in both single-threaded and multi-threaded applications.

  • Częstotliwość
    2.30 GHz
  • Rdzenie CPU
    24
  • Turbo (1 rdzeń)
    3.20 GHz
  • CPU Threads
    48
  • Turbo (24 Cores)
    2.70 GHz
  • Hyperthreading
    Tak
  • Overclocking
    Nie
  • Architektura podstawowa
    normal
  • A core
    --
  • B core
    --
  • C core
    --
IGPU

This section provides details on the integrated graphics capabilities of the processor. It covers the architecture, performance characteristics, and supported technologies (e.g., DirectX, OpenGL), which are essential for systems without dedicated GPUs or for mobile devices that require energy-efficient graphics processing.

  • Nazwa procesora graficznego
    brak iGPU
  • GPU frequency
  • GPU (Turbo)
    No turbo
  • Jednostki wykonawcze
  • Shader
  • Max. GPU Memory
    --
  • Max. displays
  • Pokolenie
  • DirectX Version
  • Proces technologiczny
  • Data wydania
Obsługa kodeków sprzętowych

This section covers the built-in hardware codec support for video and image processing. The processor’s ability to handle codecs like H.264, HEVC, and VP9 directly influences its performance in tasks such as video playback, editing, and streaming. This hardware acceleration ensures smoother media handling with lower CPU utilization.

  • h265 / HEVC (8 bit)
    Nie
  • h265 / HEVC (10 bit)
    Nie
  • h264
    Nie
  • VP9
    Nie
  • VP8
    Nie
  • AV1
    Nie
  • AVC
    Nie
  • VC-1
    Nie
  • JPEG
    Nie
Memory Specs & PCI

This section breaks down the technical characteristics of the memory supported by the processor, including the types (e.g., DDR4, DDR5), number of memory channels, and maximum supported memory speed. It also covers PCI Express support, which determines the bandwidth available for GPUs, SSDs, and other peripherals, critical for high-performance systems.

  • Typ pamięci
    DDR4-3200
  • Max. Pamięć
  • ECC
    Tak
  • Kanały pamięci
    8
  • Wersja PCIe
    4.0
  • Pasma PCIe
    128
Szyfrowanie

This section focuses on the hardware-based security technologies integrated into the processor. These include encryption support features such as AES-NI, Intel SGX, and AMD Secure Memory Encryption, which provide robust protection for sensitive data and help mitigate cybersecurity risks.

  • AES-NI
    Tak
Zużycie energii
  • TDP (PL1)
    155 W
  • TDP up
    --
  • TDP (PL2)
    --
  • TDP down
    --
  • Temperatura maksymalna
    --
* zob. poniżej
Technologies and Extensions

This section explains the underlying technologies that enable the processor to deliver high performance. It includes details about the manufacturing process (e.g., 7nm, 10nm), supported instruction sets (e.g., AVX, SSE), and virtual machine extensions that enhance compatibility and efficiency across various workloads.

  • Zestaw instrukcji (ISA)
    x86-64 (64 bit)
  • Wirtualizacja
    AMD-V, SVM
  • Rozszerzenia ISA
    SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
  • L2-Cache
    --
  • L3-Cache
    128.00 MB
  • Architektura
    Rome (Zen 2)
  • Proces technologiczny
    7 nm
  • Gniazdo
    SP3
  • Data wydania
    Q3/2019
  • Part Number
    --
Pozycje we wszystkich rankingach

Wspólne stanowiska AMD Epyc 7352 Procesor w popularnych benchmarkach, dla porównania z innymi modelami.

  • Cinebench R20 (Single-Core)
    364 place
  • Estimated results for PassMark CPU Mark
    59 place

Benchmarki

Badania eksploatacyjne CPU

Compare the benchmark scores of AMD Epyc 7352 with other processors to gauge its real-world performance across various tasks..

These tests encompass tasks such as mathematical calculations, 3D rendering, cryptocurrency mining, and performance evaluations in both single-core and multi-core modes.

Cinebench R20 (Single-Core)
Cinebench R20 SC jest testem CPU o wysokim obciążeniu dla długich zadań na komputerze stacjonarnym lub notebooku, wykorzystuje jeden rdzeń CPU, bez hipetradingu.

Synonimy

Podobne procesory pod względem wydajności.

Podobne w technicznych procesorach danych z AMD Epyc 7352.

AMD Epyc 7643 Zobacz
AMD Epyc 7352 Zobacz
AMD Epyc 7642 Zobacz
AMD Epyc 7451 Zobacz
AMD Ryzen 7 3700C Zobacz
AMD Ryzen Embedded V1202B Zobacz
Intel Celeron G1610T Zobacz
Intel Core i3-10100TE Zobacz

*

PL1 - The power limit (in watts) generated by the processor (or GPU) during sustained, standard operation. It represents the typical thermal output during normal workloads.

PL2 - Represents the maximum power limit under heavy load or overclocking conditions. It indicates the thermal output during peak performance.

These values are essential for determining the optimal cooling system and power supply required to maintain stable performance.

Oceń procesor
AMD Epyc 7352

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